Cooling a large microprocessor in a small module

• US 5,473,506 A
• Filed: 11/12/1993
• Issued: 12/05/1995
• Est. Priority Date: 11/12/1993
• Status: Expired due to Fees

• Current Assignee: PDACO LIMITED
• Original Assignee: Elonex Technologies, Inc.
• Inventors: Kikinis, Dan
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/152,431
• Time in Patent Office: 753 Days
• Field of Search: 174/16.3, 165/80.3, 165/185, 257/718-719, 257/726-727, 361/687-690, 361/704, 361/707-711, 361/720, 361/725, 361/727
• US Class Current: 361/688
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1632 External expansion units, e.g. docking stations
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H04M 1/2473 Telephone terminals interfacing a personal computer, e.g. using an API (Application Programming Interface) details of API H04M7/0021
• CPC Class Codes: H04M 1/725 Cordless telephones user interfaces specially adapted therefor H04M1/724
• CPC Class Codes: H04M 3/42323 PBX's with CTI arrangements
• CPC Class Codes: H04N 2201/0049 By wire, cable or the like
• CPC Class Codes: H04N 2201/0051 Card-type connector, e.g. PCMCIA card interface
• CPC Class Codes: H04N 2201/0053 Optical, e.g. using an infrared link
• CPC Class Codes: H05K 5/0273 having extensions for peripherals, e.g. LAN, antennas details of antennas H01Q1/2275
• CPC Class Codes: H05K 5/0291 for multiple cards

Abstract

A modular computer with docking bays for receiving functional modules and connecting the functional modules to internal computer circuitry has translatable heat-sink structures for contacting docked functional modules to extract waste heat generated by operation of the functional modules. The structures are mechanically actuated to retract to provide clearance for insertion and withdrawal of functional modules, and to advance to contact modules when docked. Heat-sink structures are shaped in some embodiments to securely retain docked modules, and in some instances, the translation of the heat-sink structures is by electrically operable actuators, which may be actuated by signals from a CPU of the modular computer. In these instances, the computer may be configured to require a security code or special input sequence to retract the heat-sink structures allowing a module to be removed.

Claims

1. A cooling system adapted to be used in a computer having a CPU, an external case, and a docking bay with a window for receiving a functional module in a first direction, comprising:

a heat-sink structure adapted to be mounted within the docking bay for contacting and cooling a functional module in docked position; and

translation apparatus connected to the heat-sink structure for moving the heat-sink structure against a module in docked position to accomplish heat absorption from the module;

wherein the translation apparatus moves the heat-sink structure in a second direction substantially orthogonal to the first direction.

2. A module cooling system as in claim 1 wherein the heat-sink structure is a substantially flat metal cooling plate.

3. A module cooling system as in claim 1 further comprising a layer of flexible, heat-conducting material affixed to the heat-sink structure for providing a conformal interface between the heat sink structure and a docked functional module.

4. A module cooling system as in claim 1 wherein the translation apparatus further comprises a lever external to the computer case, the lever operable by a user to operate the translation apparatus.

5. A module cooling system as in claim 1 wherein the translation apparatus is operated by an electrically operable actuator, such as a solenoid.

6. A module cooling system as in claim 5 wherein the electrically operable actuator is controlled by electrical signals initiated by the CPU.

15. A module cooling system as in claim 1 wherein the heat-sink structure comprises an extension for engaging an element of a docked functional module in docked position in the docking bay with the heat-sink structure in contact with the docked module, engagement of the extension blocking removal of the docked module from the docking bay.

7. A computer system comprising:

an external case;

a CPU connected to an internal communication bus;

a docking bay comprising a window in the case for inserting a functional module in a first direction, and a connector to the internal communication bus for engaging an electrical connector of the functional module;

a heat-sink structure within the docking bay movable to a position to contact any functional module docked; and

translation apparatus attached to the heat-sink structure for moving the heat-sink structure against a module in docked position to accomplish heat absorption from the module;

wherein the translation apparatus moves the heat-sink structure in a second direction substantially orthogonal to the first direction.

8. A computer system as in claim 7 wherein the heat-sink structure is a substantially flat metal cooling plate.

9. A computer system as in claim 7 further comprising a layer of flexible, heat-conducting material affixed to the heat-sink structure for providing a conformal interface between the heat-sink structure and a functional module.

10. A computer system as in claim 7 wherein the translation apparatus further comprises a lever external to the computer case, the lever operable by a user to operate the translation apparatus.

11. A computer system as in claim 7 wherein the translation apparatus is operated by an electrically operable actuator, such as a solenoid.

12. A computer system as in claim 11 wherein the electrically operable actuator is controlled by electrical signals initiated by the CPU.

13. A computer system as in claim 12 wherein the translation apparatus is operable by the CPU to withdraw the heat-sink structure from the docked module in a direction opposite to the second direction, and withdrawal requires a preprogrammed security code entered by a user.

14. A computer system as in claim 7 wherein the heat-sink structure comprises an extension for engaging an element of a docked module in docked position in the docking bay with the heat-sink structure in contact with the docked module, engagement of the extension blocking removal of the docked module from the docking bay.