Singulated bare die tester and method of performing forced temperature electrical tests and burn-in
First Claim
1. A reusable test socket for performing forced temperature pre-burn-in, burn-in and post burn-in electrical tests upon a singulated semiconductor bare die having bond pads thereon forming a bond pad pattern, said reusable test socket comprising:
- die carrier having a top surface and a bottom surface;
a plurality of at least two-element structures for continuously and repetitively establishing electrical continuity between said bare die bond pads and said die carrier, each of said at least two-element structures being posed on said top surface of the die carrier to correspond with said bond pad pattern of the semiconductor bare die to be tested, each of said at least two-element structures comprising,a circuit pad, andan electrically conductive nonadhesive, malleable elastomeric probe placed on top of, and in electrical continuity with, said circuit pad;
a means for electrically connecting the at least two-element structures posed on the top surface of the die carrier to an instrument for testing the die; and
a means for orienting the bond pads of the semiconductor bare die into alignment with corresponding at least two-element structures posed on the die carrier.
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0 Petitions
Accused Products
Abstract
A reusable test socket is described for testing singulated bare die to determine, before packaging, that the bare die is a "known good die". The socket contains a circuit pad pattern in the mirror image of the bond pad pattern of the bare die to be tested. Each pad of the socket contains a conductive elastomeric probe which has been "screened" onto the bond pad. The socket also contains an alignment template for orienting the bare die onto the elastomeric probes of the pad pattern of the test socket. Additionally, the socket can be a singular piece or it can be made of two main pieces; the first being a socket, and the second being a test board designed to mate with the socket. Further, the socket can be utilized in conjunction with a clamp for holding the bare die in place and with a thermoelectric cooler. The thermoelectric cooler is used to heat or cool the die at all temperatures required for military certification and other extended temperature applications. The disclosed invention also includes a method of using the reusable test socket which includes the steps of placing the bare die onto the test socket, placing the socket into electrical continuity with test equipment, conducting tests at ambient temperatures, subjecting the die to a prolonged period of "burn-in" at elevated temperatures, conducting further electrical tests at various temperatures, and determining whether the bare semiconductor die is a "known good die".
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Citations
15 Claims
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1. A reusable test socket for performing forced temperature pre-burn-in, burn-in and post burn-in electrical tests upon a singulated semiconductor bare die having bond pads thereon forming a bond pad pattern, said reusable test socket comprising:
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die carrier having a top surface and a bottom surface; a plurality of at least two-element structures for continuously and repetitively establishing electrical continuity between said bare die bond pads and said die carrier, each of said at least two-element structures being posed on said top surface of the die carrier to correspond with said bond pad pattern of the semiconductor bare die to be tested, each of said at least two-element structures comprising, a circuit pad, and an electrically conductive nonadhesive, malleable elastomeric probe placed on top of, and in electrical continuity with, said circuit pad; a means for electrically connecting the at least two-element structures posed on the top surface of the die carrier to an instrument for testing the die; and a means for orienting the bond pads of the semiconductor bare die into alignment with corresponding at least two-element structures posed on the die carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A process for burn-in testing of a singulated semiconductor bare die having bond pads, which bond pads form a bond pad pattern, said process comprising the steps of:
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placing the semiconductor bare die into electrical contact with a reusable test socket for testing singulated bare die, said reusable test socket having a plurality of at least two-element structures comprising a circuit pad and a malleable, nonadhesive, elastomeric probe placed on top of said circuit pad for continuously and repetitively establishing electrical continuity between said bond pads and said reusable test socket; urging the semiconductor die onto said plurality of malleable elastomeric probes to establish electrical continuity between the bond pads on the die being tested and the corresponding circuit pads of the test socket; placing the reusable test socket for testing singulated bare die into electrical continuity with an instrument for testing the die; placing the die into thermal communication with a temperature changing device; exercising the die at a raised temperature for a sufficient amount of time to satisfy burn-in certification requirements; and periodically sampling electrical signal levels from the die to verify that electrical continuity exists between the die and the test socket while the die is being exercised during burn-in. - View Dependent Claims (14, 15)
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10. A process for testing singulated semiconductor bare die having bond pads thereon forming a bond pad pattern, said process comprising the steps of:
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placing the semiconductor bare die into electrical contact with a reusable test socket for testing singulated bare die, said reusable test socket having a plurality of at least two-element structures comprising a circuit pad and a malleable, nonadhesive elastomeric probe placed on top of said circuit pad for continuously and repetitively establishing electrical continuity between said bond pads and said reusable test socket; urging the semiconductor bare die onto a plurality of malleable elastomeric probes to insure that all of the bond pads on the die being tested are in electrical continuity with the corresponding circuit pads of the test socket; placing the reusable test socket for testing singulated bare die into electrical continuity with an instrument for testing the die; and performing tests. - View Dependent Claims (11, 12)
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13. A process for performing forced temperature electrical tests upon a singulated bare die having bond pads thereon forming a bond pad pattern to determine whether the die is a known good die which comprises:
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placing the semiconductor bare die into electrical continuity with a reusable test socket for testing singulated bare die, said reusable test socket having a plurality of at least two element structures comprising a circuit pad and a malleable, nonadhesive elastomeric probe placed on top of said circuit pad for continuously and repetitively establishing electrical continuity between said bond pads and said reusable test socket; placing the reusable test socket for testing bare singulated die into electrical continuity with an instrument for testing the die; placing the die into thermal communication with a thermoelectric cooler; performing electrical tests upon the die at a raised or lowered temperature whereby the raised or lowered temperature increases the probability that a defective die will fail; subsequently exercising the die while it is in thermal communication with a temperature changing device for an extended period of time sufficient to satisfy burn-in certification requirements; periodically sampling electrical signal levels from the die to verify that electrical continuity exists between the die and the test socket while the die is in thermal communication with the temperature changing device and while the die is being exercised; and subsequently performing post burn-in testing which is comprised of in no particular order; electrically testing the die at ambient temperature wherein ambient temperature is approximately 25°
Celsius,electrically testing the die at a high temperature wherein the high temperature can be as high as 125°
Celsius and is determined by certification standards, andelectrically testing the die at a low temperature wherein the low temperature can be as low as (-)55°
Celsius and is determined by certification standards;whereby the die is certified as a known-good-die upon completion of the post burn-in testing.
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Specification