Transferred single crystal arrayed devices including a light shield for projection displays

• US 5,475,514 A
• Filed: 08/11/1994
• Issued: 12/12/1995
• Est. Priority Date: 12/31/1990
• Status: Expired due to Term

• Current Assignee: Kopin Corporation
• Original Assignee: Kopin Corporation
• Inventors: Spitzer, Mark B., Zavracky, Paul M., Dingle, Brenda, Salerno, Jack P.
• Primary Examiner(s): Gross, Anita Pellman
• Assistant Examiner(s): TRICE, RONALD
• Application Number:
  US08/289,129
• Time in Patent Office: 488 Days
• Field of Search: 156/603, 156/DIG. 88, 437/233, 359/59, 359/41, 359/67, 117/4, 117/43
• US Class Current: 438/27
• CPC Class Codes: A61B 3/113 for determining or recording eye movement
• CPC Class Codes: G02B 2027/0132 comprising binocular systems
• CPC Class Codes: G02B 2027/0138 comprising image capture systems, e.g. camera
• CPC Class Codes: G02B 2027/0187 slaved to motion of at least a part of the body of the user, e.g. head, eye
• CPC Class Codes: G02B 2027/0198 System for aligning or maintaining alignment of an image in a predetermined direction
• CPC Class Codes: G02B 27/0093 with means for monitoring data relating to the user, e.g. head-tracking, eye-tracking
• CPC Class Codes: G02B 27/017 Head mounted
• CPC Class Codes: G02B 27/0172 characterised by optical features
• CPC Class Codes: G02B 5/30 Polarising elements light-modulating devices with active elements G02F1/00
• CPC Class Codes: G02F 1/13613 the semiconductor element being formed on a first substrate and thereafter transferred to the final cell substrate
• CPC Class Codes: G03B 21/10 Projectors with built-in or built-on screen
• CPC Class Codes: G03B 21/28 Reflectors in projection beam in illumination beam G03B21/2066
• CPC Class Codes: G03B 33/12 using beam-splitting or beam-combining systems, e.g. dichroic mirrors
• CPC Class Codes: G03B 37/04 with cameras or projectors providing touching or overlapping fields of view
• CPC Class Codes: G09G 2300/023 Display panel composed of stacked panels
• CPC Class Codes: G09G 2300/0809 Several active elements per pixel in active matrix panels
• CPC Class Codes: G09G 2300/0842 forming a memory circuit, e.g. a dynamic memory with one capacitor
• CPC Class Codes: G09G 2320/0233 Improving the luminance or brightness uniformity across the screen
• CPC Class Codes: G09G 2320/041 Temperature compensation
• CPC Class Codes: G09G 2320/043 Preventing or counteracting the effects of ageing
• CPC Class Codes: G09G 2340/0464 : Positioning
• CPC Class Codes: G09G 2370/042 : for monitor identification
• CPC Class Codes: G09G 3/30 : using electroluminescent panels
• CPC Class Codes: G09G 3/36 : using liquid crystals
• CPC Class Codes: G09G 3/3607 : for displaying colours or for displaying grey scales with a specific pixel layout, e.g. using sub-pixels display of colours in flat matrix panels other than liquid crystal displays G09G3/2003; grey scales specific for television H04N3/127
• CPC Class Codes: G09G 3/3614 : Control of polarity reversal in general
• CPC Class Codes: G09G 3/3648 : using an active matrix G09G3/367 - G09G3/3696 take precedence
• CPC Class Codes: H01L 21/8221 : Three dimensional integrated circuits stacked in different levels
• CPC Class Codes: H01L 2221/68359 : used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 : used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 25/0756 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/0688 : Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/1214 : comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 : the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/1274 : using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 29/786 : Thin film transistors, i.e. transistors with a channel being at least partly a thin film transistors having only the source or the drain region on an insulator layer H01L29/0653; thin film FinFETs H01L29/785
• CPC Class Codes: H01L 29/78603 : characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 29/78648 : arranged on opposing sides of the channel
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 33/0062 : for devices with an active region comprising only III-V compounds
• CPC Class Codes: H01S 5/423 : having a vertical cavity
• CPC Class Codes: H04N 5/70 : Circuit details for electroluminescent devices
• CPC Class Codes: H04N 5/74 : Projection arrangements for image reproduction, e.g. using eidophor
• CPC Class Codes: H04N 5/7441 : the modulator being an array of liquid crystal cells
• CPC Class Codes: H04N 5/7491 : of head mounted projectors
• CPC Class Codes: H04N 9/3108 : by using a single electronic spatial light modulator
• CPC Class Codes: H04N 9/312 : Driving therefor driving of electronic spatial light modulators in displays other than projection devices G09G3/34, G09G3/36; control of liquid crystal elements G02F1/133; control of micromechanical modulators G02B26/08
• CPC Class Codes: H04N 9/3141 : Constructional details thereof details not peculiar to the presence of an electronic spatial light modulator G03B21/14
• CPC Class Codes: H04N 9/3173 : wherein the projection device is specially adapted for enhanced portability
• CPC Class Codes: H05B 33/12 : Light sources with substantially two-dimensional radiating surfaces

Abstract

A display panel is formed using a single crystal thin-film transistors that are transferred to substrates for display fabrication. Pixel arrays form light valves or switches that can be fabricated with control electronics in the thin-film material prior to transfer. The resulting circuit panel is then incorporated into a projection display system with a light emitting or liquid crystal material to provide the desired light valve.

Claims

1. A method of fabricating a projection display comprising:

a) providing a back-light source;

b) forming single crystal silicon material on a supporting substrate;

c) forming an array of transistors and an array of electrodes such that each electrode is connected to at least one of the transistors, each transistor being formed in the single crystal silicon;

d) forming an insulator material and a first optical shield material over each transistor in the array of wherein the insulator material is between the transistor and the first optical shield material;

e) transferring the array of transistors, array of electrodes and the first optical shield material onto an optically transmissive substrate, the single crystal silicon material being attached to the optically transmissive substrate with an adhesive;

f) positioning adjacent to the array of electrodes a light transmitting material through which light from the back-light source is selectively transmitted to form a light valve matrix such that each light valve is actuatable by a transistor; and

g) providing an optical system for projecting light transmitted through actuated light valves onto a viewing surface.

2. The method of claim 1 wherein step b) comprises forming a non-single crystal silicon material over the supporting substrate;

and

crystallizing the non-single crystal silicon material to form an essentially single crystal silicon material.

3. The method of claim 1 wherein the adhesive is an epoxy.

4. The method of claim 1 wherein the light transmitting material comprises a liquid crystal.

5. The method of claim 2 further comprising forming a driver circuit in the essentially single crystal silicon material such that each transistor is electrically connected to and selectively driven by the driver circuit.

6. A method of fabricating a projection display comprising:

a) providing a back-light Source;

b) forming an essentially single crystal silicon material on an insulating layer that is over a supporting substrate;

c) forming an array of transistors and an array of electrodes in the essentially single crystal silicon material;

d) forming an insulator material and a first optical shield material over each

transistor in the array of;

e) transferring the essentially single crystal silicon material and the arrays of transistors and electrodes and the first optical shield material onto an optically transmissive substrate, the essentially single crystal silicon material being attached to the optically transmissive substrate with an adhesive;

f) positioning adjacent to the array of electrodes a light transmitting material to form a light valve matrix wherein an electric field generated by each light valve alters a light transmitting property of the light transmitting material such that light from the back-light source is selectively transmitted through the light transmitting material surface; and

g) providing an optical system for protecting light transmitted through actuated light valves onto an enlarged viewing surface.

7. The method of claim 6 wherein step b) comprises forming a non-single crystal silicon material over the supporting substrate;

and

crystallizing the non-single crystal silicon material to form the essentially single crystal silicon material.

8. The method of claim 6 wherein the light transmitting material comprises a liquid crystal.

9. The method of claim 6 further comprising forming a driver circuit in the essentially single crystal silicon material such that each transistor is electrically connected to and selectively driven by the drive circuit.

10. A method of fabricating a projection display comprising:

providing a back-light source within a monitor;

forming single crystal silicon material on an insulating layer that is over a supporting substrate;

forming an array of transistors and an array of electrodes in the single crystal material;

forming an insulator material and a first optical shield over each wherein the insulator material is between the transistor and the first optical shield array;

transferring the transistor array with the first optical shield and the array of electrodes onto an optically transmissive substrate;

positioning adjacent to the array of electrodes a light transmitting material through which light from the back-light source is selectively transmitted to form a light valve matrix such that each light valve is actuatable by a transistor, the light valve matrix being positioned within the monitor to receive light from the source; and

providing an optical system within the monitor for projecting light transmitted through actuated light valves onto a viewing surface of the monitor.

11. The method of claim 10 wherein the array has a rectangular shape with a diagonal length less than about 42 mm.

12. The method of claim 10 wherein the optical system comprises a 35 mm lens.

13. The method of claim 10 wherein a second optical shield is formed on a side of the transistor opposite the first optical shield after the step of transferring.