Method of soldering an electric cable to a circuit board

• US 5,478,008 A
• Filed: 10/18/1994
• Issued: 12/26/1995
• Est. Priority Date: 10/28/1993
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Takahashi, Hiroji
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US08/324,613
• Time in Patent Office: 434 Days
• Field of Search: 228/179.1, 228/214, 228/222, 228/106, 228/5.5, 228/44.7, 29/868, 29/869
• US Class Current: 228/214
• CPC Class Codes: H01R 12/62 connecting to rigid printed circuits or like structures
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H01R 43/0249 for simultaneous welding or soldering of a plurality of wires to contact elements
• CPC Class Codes: H05K 2201/10356 Cables
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2201/10977 Encapsulated connections
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/1311 Foil encapsulation, e.g. of mounted components
• CPC Class Codes: H05K 2203/304 Protecting a component during manufacturing
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electric cable is soldered to an electronic circuit board by sticking the heat-resistive adhesive tape on the end portion of the insulating ocating and the end portion of the core conductor of the cable, and melting solder by contacting the heater tip on the heat-resistive adhesive tape. Therefore, the coating of the electric cable is prevented from being peeled off when heated and the heater tip is free from solder dregs.

Claims

1. A soldering method for soldering an electric cable to a wiring pattern of a circuit board, comprising:

a first step of contacting an exposed top portion of a core conductor of the electric cable, having a heat-resistive adhesive tape stuck on the exposed top portion of the core conductor and an edge of an insulating coating of the electric cable, with a solder connecting point of a wiring pattern; and

a second step of soldering the core conductor to the solder connecting point by heating it while contacting a heater tip with the heat-resistive adhesive tape on the core conductor.

2. The soldering method claimed in claim 1, further comprising, before said first step, a step of forming a solder bump on the solder connecting point.

3. The soldering method claimed in claim 2, wherein the heat-resistive adhesive tape is composed of a heat-resistive member and an adhesive attached on one surface of the heat-resistive member, melting point of the heat-resistive member is higher than melting point of the solder as well as heating temperature of the heater tip.

4. The soldering method claimed in claim 3, wherein thickness of the heat-resistive member is 100 μ

m or less.

5. The soldering method claimed in claim 3, wherein the adhesive is of a thermosetting material whose bonding ability is improved by heat from the heater tip.

6. The soldering method claimed in claim 1, wherein in the second step, the heater tip contacts with the heat-resistive adhesive tape for several seconds.

7. The soldering method claimed in claim 1, wherein the electric cable is a flat-cable including a plurality of core conductors having end portions exposed, and the heat-resistive adhesive tape is stuck on an end portion of the insulating coating and the exposed core conductors.