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Thermal isolation of hybrid thermal detectors through an anisotropic etch

  • US 5,478,242 A
  • Filed: 04/29/1994
  • Issued: 12/26/1995
  • Est. Priority Date: 04/29/1994
  • Status: Expired due to Term
First Claim
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1. A method for fabricating a thermal isolation structure disposed between a focal plane array and an integrated circuit substrate of a hybrid thermal detection system, comprising the steps of:

  • providing the focal plane array with at least three thermal sensors for generating a sensor signal output representative of the thermal radiation incident to the focal plane array;

    providing the integrated circuit substrate with at least three contact pads for coupling to the focal plane array;

    forming at least three mesa-type formations from a thermally insulating material, the mesa-type formations projecting adjacent to the contact pads of the integrated circuit substrate;

    forming at least three mesa strip conductors extending from the top of the mesa-type formations to the contact pads of the integrated circuit substrate, each mesa strip conductor coupling at least one of the thermal sensors in the focal plane array to an associated contact pad of the integrated circuit substrate; and

    anisotropically etching the mesa-type formations using the mesa strip conductors as an etch mask.

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