Method for preparing a screen printing stencil

• US 5,478,699 A
• Filed: 03/12/1992
• Issued: 12/26/1995
• Est. Priority Date: 03/12/1992
• Status: Expired due to Term

• Current Assignee: Photo Stencil, LLC
• Original Assignee: AMTX, Inc. (Xerox Holdings Corp.)
• Inventors: Blessington, deceased, Daniel R., Sergent, Jerry E., De Lucia, Stephen A., Marks, Gary T., Sline, Judy A.
• Primary Examiner(s): Seidleck, James J.
• Assistant Examiner(s): COONEY, JOHN M
• Application Number:
  US07/849,862
• Time in Patent Office: 1,384 Days
• Field of Search: 430/308, 430/324, 430/935, 101/128.21, 101/128.4, 101/129, 101/127, 427/96, 427/98, 205/67, 205/76, 205/78, 205/69, 205/70, 205/127
• US Class Current: 430/308
• CPC Class Codes: B41C 1/142 using a galvanic or electroless metal deposition processing step
• CPC Class Codes: B41M 1/12 Stencil printing; Silk-screen printing
• CPC Class Codes: G03F 7/12 Production of screen printing forms or similar printing forms, e.g. stencils
• CPC Class Codes: H05K 3/1225 Screens or stencils; Holders therefor
• CPC Class Codes: Y10S 430/136 Coating process making radiation sensitive element

Abstract

To prepare a screen printing stencil, a pattern of resist, having a complementary design to the final screen printing stencil, is applied to a conductive mandrel. A patterned layer is electroformed onto the exposed surface of the mandrel such that the layer corresponds to the exposed orifices of the pattern of resist. The resulting screen printing stencil can have an overgrowth geometry or a straight-wall geometry depending on the type of photoresist employed, and can be used in the electronic substrate fabrication and electronic assembly industries.

Claims

1. A method for fabricating an electrical substrate comprising:

(a) applying a pattern of thick film resist, which is complementary to a pattern of a screen printing stencil for an electrical circuit, onto a conductive mandrel, wherein said pattern of thick film resist has a thickness of greater than 0.01 mm;

(b) electroforming a patterned metal layer onto portions of the mandrel determined by the pattern of resist;

(c) removing the layer from the mandrel to provide a screen printing stencil; and

(d) placing said stencil adjacent an electrical substrate and printing said electrical circuit thereon.

2. The method of claim 1, wherein the thin film liquid resist is 2-ethoxyethyl acetate, n-butyl acetate, xylene, o-chlorotoluene or toluene.

3. The method of claim 1, wherein the pattern of resist comprises a dry film resist.

4. The method of claim 3, wherein the dry film resist is benzophenone,methyl-4-(trichloromethyl)-2,5-cyclohexadienone-1, ethyl-4-dimethylamino benzoate, tetramethylsuccinonitrile, methanol or polyacrylate monomer.

5. The method of claim 1, wherein the pattern of resist comprises a thick film liquid resist.

6. The method of claim 5, wherein the thick film liquid resist is 2-ethoxyethyl acetate, n-butyl acetate, xylene, o-chlorotoluene or toluene.

7. The method of claim 1, wherein the metal layer comprises at least one member selected from the group consisting of nickel, copper, gold, silver, palladium, tin, lead, cobalt, chromium, iron, zinc and an alloy thereof.

8. The method of claim 1, wherein the metal is nickel or copper.

9. The method of claim 1, wherein the layer is nickel-boron, copper-nickel phosphorus, nickel-polytetrafluoroethylene or a composite thereof.

10. The method of claim 2, wherein the layer consists essentially of nickel.

11. The method of claim 3, wherein the layer consists essentially of nickel.

12. The method of claim 5, wherein the layer consists essentially of nickel.

13. The method of claim 1, wherein steps (a) and (b) are repeated at least once to provide a multilayer screen printing stencil for an electrical circuit.

14. A screen printing stencil prepared according to the method of claim 1, wherein an orifice of the stencil is about 0.1 mm to about 0.2 mm wide.

15. A screen printing stencil prepared according to the method of claim 1, wherein a distance between orifices of the stencil is about 0.1 mm to about 0.2 mm.

16. The method of claim 1, wherein the metal layer is about 0.004 mm to about 0.2 mm thick.

17. A screen printing stencil prepared according to the method of claim 1, wherein an orifice of the stencil is about 0.1 mm to about 0.2 mm wide.

18. A screen printing stencil prepared according to the method of claim 1, wherein a distance between orifices of the stencil is about 0.1 mm to about 0.2 mm.

23. The method of claim 2, wherein the thin film liquid resist is a photoactive compound or blend of photoactive compounds.

24. The method of claim 3, wherein the dry film resist is a photoactive compound or blend of photoactive compounds.

25. The method of claim 5, wherein the thick film liquid resist is a photoactive compound or blend of photoactive compounds.

27. The method of claim 1, wherein the thick film pattern of resist is at least 0.1 mm thick.

28. The method of claim 1, wherein at least one section of the patterned metal layer has a thickness between about 0.1 mm and about 0.2 mm.

19. A method for fabricating a screen printing stencil for electronic substrate fabrication having different thicknesses in different portions of the stencil comprising:

(a) applying a first pattern of resist, which is complementary to a pattern of the screen printing stencil for an electrical circuit, onto a conductive mandrel;

(b) electroforming a first patterned metal layer onto the conductive mandrel as determined by the first pattern of resist to form an electroformed layer;

(c) depositing a second pattern of resist on only a portion of the first electroformed patterned layer;

(d) electroforming a second patterned metal layer onto the first patterned layer as determined by the second layer of a pattern of resist;

resulting in further growth of the thickness of the electroformed layer only on portions of the first electroformed layer not coated with the second layer of a pattern of resist.

20. The method of claim 19, further comprising placing said stencil adjacent an electronic substrate material and printing thereon conductors, resistors or dielectrics.

21. The method of claim 19, further comprising placing said stencil adjacent an electronic substrate material and printing thereon solder masks or solder pastes.

22. A method for fabricating an electrical substrate, comprising:

(a) applying a pattern of thick film resist complementary to a pattern of a screen printing stencil for a conductor, resistor, dielectric, solder mask or solder paste onto a conductive mandrel, wherein said pattern of thick film resist has a thickness of greater than 0.01 mm;

(b) electroforming a patterned metal layer onto portions of the mandrel determined by the pattern of resist;

(c) removing the layer from the mandrel to provide a screen printing stencil; and

(d) placing said stencil adjacent an electrical substrate material and printing thereon a conductor, resistor, dielectric, solder mask or solder paste.

26. A method for fabricating an electrical substrate comprising:

(a) applying a pattern of thin film liquid resist, which is complementary to a pattern of a screen printing stencil for an electrical circuit, onto a conductive mandrel;

(b) electroforming a patterned metal layer onto portions of the mandrel determined by the pattern of resist such that the patterned metal layer overlaps the pattern of resist at resist spots to form a depressed orifice in the electroformed layer;

(c) removing the layer from the mandrel to provide a screen printing stencil; and

(d) placing said stencil adjacent an electrical substrate and printing said electrical circuit thereon.