Composition of epoxy resin, epoxidized block polydiene and curing agent

• US 5,478,885 A
• Filed: 04/15/1994
• Issued: 12/26/1995
• Est. Priority Date: 04/15/1994
• Status: Expired due to Term

• Current Assignee: Shell Elastomers LLC (DL Holdings Co., Ltd.)
• Original Assignee: Shell Oil Company (Shell Plc)
• Inventors: Erickson, James, Dangayach, Kailash, Masse, Michael A.
• Primary Examiner(s): Sellers, Robert E.
• Application Number:
  US08/228,324
• Time in Patent Office: 620 Days
• Field of Search: 525/92
• US Class Current: 525/92.00H
• CPC Class Codes: C08C 19/40 with epoxy radicals
• CPC Class Codes: C08G 59/027 obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
• CPC Class Codes: C08G 59/38 together with di-epoxy compounds
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 63/08 Epoxidised polymerised polyenes

Abstract

The present invention provides a toughened epoxy resin composition comprising:

(a) a curable aromatic epoxy resin,

(b) an epoxidized low viscosity polydiene polymer wherein the polymer contains from 1.0 to 7.0 milliequivalents of epoxy per gram of polymer, and

(c) a curing agent.

Claims

1. A toughened epoxy resin composition comprising:

(a) a curable aromatic epoxy resin,

(b) an epoxidized low viscosity polydiene polymer which contains less than 5% by weight of a vinyl aromatic hydrocarbon wherein the polymer contains from 4.5 to 5.5 milliequivalents of epoxy per gram of polymer, and has the structural formula

space="preserve" listing-type="equation">(A-B-A.sub.p).sub.n -Y.sub.r -(A.sub.q -B).sub.m

wherein Y is a coupling agent or coupling monomers or initiator, and wherein A and B are polymer blocks which may be homopolymer blocks of conjugated diolefin monomers or copolymer blocks of conjugated diolefin monomers, the A blocks have a molecular weight of from 100 to 6,000 and the B blocks have a molecular weight of from 1000 to 15,000, n is greater than 0, r is 0 or 1, m is greater than or equal to 0, n+m ranges from 1 to 100, and p and q may be 0 or 1, and

(c) a curing agent.

2. The composition of claim 1 wherein the curing agent is selected from the group consisting of phthalic anhydride, substituted phthalic anhydrides, hydrophthalic anhydrides, substituted hydrophthalic anhydrides, succinic anhydride, substituted succinic anhydrides, halogenated anhydrides, multifunctional carboxylic acids other than polycarboxylic acids, and polycarboxylic acids.

3. The composition of claim 1 wherein the curing agent is selected from the group consisting of aliphatic amines, aromatic amines, polyamides, amido amines and imidazoles.

4. The composition of claim 1 wherein the aromatic epoxy resin is a glycidyl ether prepared by the reaction of epichlorohydrin with an aromatic compound containing at least two hydroxy group carried out under alkaline reaction conditions.

5. The composition of claim 1 wherein the concentration of the epoxidized polymer ranges from 1 to 50% by weight of the composition.

6. The composition of claim 1 wherein an accelerator is added and the composition is cured.

7. The composition of claim 6 wherein the accelerator is selected from the group consisting of trialkyl amines, hydroxyl containing compounds, benzyl dimethyl amine, 2-ethyl-4-methyl imidazole, BF₃ amine complexes, phosphines, and Lewis acid compounds.

8. A structural adhesive composition comprising the composition of claim 1.

9. The composition of claim 1 wherein the epoxidized polymer is polyisoprene and has a molecular weight of from 1000 to 20,000.

10. The composition of claim 9 wherein an accelerator is added and the composition is cured.

11. A structural adhesive composition comprising the composition of claim 9.

12. The composition of claim 1 wherein the epoxidized polymers are randomly polymerized star copolymers of at least two conjugated diolefin monomers and contain di-, tri- and/or tetrasubstituted olefinic epoxides and wherein each arm has a molecular weight from 1500 to 15,000.

13. The composition of claim 12 wherein an accelerator is added and the composition is cured.

14. A structural adhesive composition comprising the composition of claim 12.