Fiber probe fabrication having a tip with concave sidewalls

• US 5,480,046 A
• Filed: 05/20/1994
• Issued: 01/02/1996
• Est. Priority Date: 12/22/1993
• Status: Expired due to Fees

• Current Assignee: AT&T IPM Corp. (AT&T, Inc.)
• Original Assignee: AT&T Corporation (AT&T, Inc.)
• Inventors: Filas, Robert W., Marchman, Herschel M.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/247,164
• Time in Patent Office: 592 Days
• Field of Search: 156/639, 156/651, 156/654, 156/659.1, 156/662, 156/663, 156/639.1, 156/651.1, 156/654.1, 156/659.11, 156/662.1, 65/31, 250/458.1, 252/79.3, 216/7, 216/8, 216/41, 216/49, 216/91, 216/97, 216/99, 385/123
• US Class Current: 216/7
• CPC Class Codes: G01Q 60/22 Probes, their manufacture, or their related instrumentation, e.g. holders

Abstract

A probe device is fabricated from a glass fiber segment by first isotropically etching only a portion of the diameter of only a bottom region thereof. Next, the bottom region is cleaved, to produce a cleaved bottom endface. Then the cleaved endface and a height of the sidewalls of the bottom region that is less than its total height are coated with a protective masking layer. The fiber segment is immersed in an isotropic etching solution, whereby its diameter is reduced. Finally, the masking layer is stripped off, and the bottom region is etched again until the (maximum) diameter of the cleaved endface is reduced to a desired value.

Claims

1. A method of making a fiber probe device including the steps of:

(a) providing a cylindrical fiber segment;

(b) etching, prior to step (c), only a cylindrical bottom region of the fiber segment, the bottom region having an initial height, whereby its maximum width is reduced;

(c) cleaving the bottom region whereby its initial height is reduced to a reduced height and a cleaved bottom endface thereof is produced;

(d) coating both the cleaved endface and a first height of the sidewalls that is equal to or less than its reduced height with a protective masking layer;

(e) etching the bottom region whereby the sidewalls thereof become concave;

(f) removing, prior to step (g), the masking layer; and

(g) etching the bottom region whereby the maximum width of the cleaved endface is reduced to a desired value.

2. The method of claim 1 in which the desired value is in the approximate range of 0.01 μ

m to 150 μ

m.

3. The method of claim 2 in which the approximate range is 0.05 μ

m to 0.5 μ

m.

4. The method of claim 2 in which the approximate range is 0.05 μ

m to 0.2 μ

m.

5. The method of claim 3 in which the cleaving is oriented in a plane perpendicular to the axis of the bottom cylindrical region.

6. The method of claim 1 in which the ratio of the first height to the reduced height is in the approximate range of 0.5 to 1.

7. The method of claim 1 in which the etching of step (e) in claim 1 is essentially isotropic.

8. The method of claim 7 in which the etching of step (g) is essentially isotropic.

9. The method of claim 1 in which the cleaving is oriented in a plane perpendicular to the axis of the bottom cylindrical region.

10. The method of claim 1 in which the reduced height is in the approximate range of 0.05 μ

m to 30 μ

m.

11. The method of claim 9 in which the ratio of the first height to the reduced height is in the approximate range of 0.5 to 1.

12. The method of claim 1 in which the reduced height is in the approximate range of 0.5 μ

m to 10 μ

m.

13. The method of claim 11 in which the ratio of the first height to the reduced height is in the approximate range of 0.5 to 1.

14. The method of claim 1 further comprising, between steps (b) and (c), the step of further etching a lowest portion of the bottom region, whereby the maximum width of the lowest portion is less than that of the bottom region.

15. The method of probing a surface of a sample body including making the fiber probe device in accordance with claim 14 followed by moving the fiber probe device across the surface of the sample body.

16. The method of claim 15 in which the protective layer is formed by dissolving a chlorofluorocarbon polymer resin in an organic solvent.

17. The method of claim 15 in which the protective layer is formed by dissolving a chlorofluorocarbon polymer resin in a ketone or an ester or a mixture of a ketone and an ester.

18. The method of claim 14 in which the fiber segment is essentially glass and in which the protective masking layer is formed by dissolving a chlorofluorocarbon polymer resin in an organic solvent.

19. The method of claim 14 in which the fiber segment is essentially glass and in which the protective masking layer is formed by dissolving a chlorofluorocarbon polymer resin in a ketone or an ester or a mixture of a ketone and an ester.

20. The method of claim 1 in which the protective masking layer is formed by dissolving a chlorofluorocarbon polymer resin in an organic solvent.

21. The method of claim 1 in which the protective masking layer is formed by dissolving a chlorofluorocarbon polymer resin in a ketone or an ester or a mixture of a ketone and an ester.

22. The method of claim 1 in which the fiber segment is essentially glass and in which the protective masking layer is formed by dissolving a chlorofluorocarbon polymer resin in an organic solvent.

23. The method of claim 1 in which the fiber segment is essentially glass and in which the protective layer is formed by dissolving a chlorofluorocarbon polymer resin in a ketone or an ester or a mixture of a ketone and an ester.

24. The method of probing a surface of a sample body including making the fiber probe device in accordance with claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 20, 21, 22, or 23 followed by moving the fiber probe device across the surface of the sample body.