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Semiconductor device manufacturing method

  • US 5,480,839 A
  • Filed: 01/11/1994
  • Issued: 01/02/1996
  • Est. Priority Date: 01/15/1993
  • Status: Expired
First Claim
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1. A semiconductor device manufacturing method comprising the steps of:

  • forming a lower-layer interconnection on a circuit board on which a plurality of semiconductor chips are mounted;

    forming a metal pillar on said circuit board so that the pillar may contact with at least said lower-layer interconnection, the metal pillar forming step including the step of effecting screen printing of a metal paste using a screen plate with openings corresponding to desired positions on the lower-layer interconnection and the step of drying and calcining said printed metal paste by heat treatment to form the metal pillar;

    forming an insulating film covering said lower-layer interconnection and said metal pillar so that the tip of said metal pillar may be exposed; and

    forming an upper-layer interconnection on said insulating film so that this layer may contact with the exposed tip of said metal pillar.

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