Semiconductor device manufacturing method
First Claim
1. A semiconductor device manufacturing method comprising the steps of:
- forming a lower-layer interconnection on a circuit board on which a plurality of semiconductor chips are mounted;
forming a metal pillar on said circuit board so that the pillar may contact with at least said lower-layer interconnection, the metal pillar forming step including the step of effecting screen printing of a metal paste using a screen plate with openings corresponding to desired positions on the lower-layer interconnection and the step of drying and calcining said printed metal paste by heat treatment to form the metal pillar;
forming an insulating film covering said lower-layer interconnection and said metal pillar so that the tip of said metal pillar may be exposed; and
forming an upper-layer interconnection on said insulating film so that this layer may contact with the exposed tip of said metal pillar.
1 Assignment
0 Petitions
Accused Products
Abstract
With a semiconductor device manufacturing method, a lower-layer interconnection is formed on a circuit board on which a plurality of semiconductor chips are mounted. Using a screen plate with openings corresponding to desired positions on the lower-layer interconnection, screen printing of a metal paste is effected, and the printed metal paste is dried and calcined by heat treatment to form a metal pillar on the lower-layer interconnection. An insulating film covering the lower-layer interconnection and the metal pillar is formed so that the tip of the metal pillar may be exposed. An upper-layer interconnection is formed on the insulating film so that this layer may contact with the exposed tip of the metal pillar.
142 Citations
7 Claims
-
1. A semiconductor device manufacturing method comprising the steps of:
-
forming a lower-layer interconnection on a circuit board on which a plurality of semiconductor chips are mounted; forming a metal pillar on said circuit board so that the pillar may contact with at least said lower-layer interconnection, the metal pillar forming step including the step of effecting screen printing of a metal paste using a screen plate with openings corresponding to desired positions on the lower-layer interconnection and the step of drying and calcining said printed metal paste by heat treatment to form the metal pillar; forming an insulating film covering said lower-layer interconnection and said metal pillar so that the tip of said metal pillar may be exposed; and forming an upper-layer interconnection on said insulating film so that this layer may contact with the exposed tip of said metal pillar. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
Specification