Multi-chip module with multiple compartments

• US 5,480,840 A
• Filed: 08/18/1994
• Issued: 01/02/1996
• Est. Priority Date: 07/14/1992
• Status: Expired due to Term

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: AT&T Global Network Services LLC (AT&T, Inc.), Symbios Logic Incorporated (Broadcom, Inc.), Hyundai Electronics America Incorporated (SK Hynix Inc.)
• Inventors: Barnes, Lawrence C., Thornberg, Gary R.
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): Picardat, Kevin M.
• Application Number:
  US08/292,448
• Time in Patent Office: 502 Days
• Field of Search: 437/209, 437/211, 437/214, 437/215, 437/217, 437/219, 437/220, 437/221, 257/685, 257/704, 257/712, 257/723, 257/724, 257/725, 361/753, 361/796, 361/800, 361/816
• US Class Current: 438/107
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating
• CPC Class Codes: Y10T 29/49137 Different components

Abstract

The present invention provides a multi-chip module having multiple compartments. Circuitry is arranged on a substrate in such a manner that circuit components requiring specific operating environments are located in discrete areas dedicated to accommodate the circuit components. A cover, having multiple chambers that align with the discrete areas on the substrate, is secured to the substrate to define the multiple compartments. The compartments are separated by material that effectively isolates the compartments relative to one another.

Claims

1. A method of making a multi-chip module, including the step of

arranging the components within the module in such a manner that circuit components requiring specific thermal environments are located in discrete areas dedicated to accommodate the components.

2. A method for heating specific components on a multichip module, the steps comprising:

arranging the components within the module in such a manner that said specific components requiring heating are located in a discrete area within said module;

enclosing said specific components within a cover, thereby forming a chamber including said specific components and thermally isolating said specific components from the other components within said multichip module; and

heating said chamber.

3. A method for cooling specific components on a multichip module, the steps comprising:

arranging the components within the module in such a manner that said specific components requiring cooling are located in a discrete area within said module;

enclosing said specific components within a cover, thereby forming a chamber including said specific components and thermally isolating said specific components from the other components within said multichip module; and

cooling said chamber.