Modular heat exchanger

• US 5,482,109 A
• Filed: 03/15/1994
• Issued: 01/09/1996
• Est. Priority Date: 03/15/1994
• Status: Expired due to Fees

• Current Assignee: E-Systems Incorporated (Rtx Corporation)
• Original Assignee: E-Systems Incorporated (Rtx Corporation)
• Inventors: Kunkel, Scott H.
• Primary Examiner(s): Leo, Leonard R.
• Application Number:
  US08/212,781
• Time in Patent Office: 665 Days
• Field of Search: 165/80.1-80.5, 165/185, 174/15.1, 174/16.1, 174/16.3, 257/712, 257/714, 361/694-697, 361/699, 361/701, 361/707, 361/709-711, 361/720, 361/721
• US Class Current: 165/80.3
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

A heat exchanger and method for mounting and cooling electronic components includes a chassis with plural removable mounting modules and a coolant distributor mounted on the modules. Each of the modules has a thermally conductive core for mounting electronic components and heat transfer ducts integral therewith that form uninterrupted thermal paths for conduction of heat from the electronic components to the coolant in the ducts. Each module has it own coolant ducts so that the weight of the heat exchanger may be reduced by the weight of the ducts when a module is removed, and so that cooling for each module may be separately tailored.

Claims

1. A modular heat exchanger comprising:

a chassis having a mounting surface;

plural modules, each of said modules being removably attachable to said mounting surface and comprising,

a thermally conductive plate for carrying electronic components, and

a heat transfer duct attached to each of two opposing edges of said plate for conveying a coolant along an edge of said plate, each said duct being connected so that coolant does not pass through more than one said duct,

said plate and each said heat transfer duct forming an uninterrupted thermal path for conducting heat from the electronic components to the coolant; and

plural fins in said duct for facilitating conduction of heat from said duct to the coolant, said fins being in thermal communication with said duct.

2. The heat exchanger of claim 1 wherein each said duct comprises two coolant conduits separated by an extension of said plate through said duct.

3. The heat exchanger of claim 2 wherein said fins are affixed to said extension.

4. The heat exchanger of claim 1 wherein said duct has an inlet for the coolant that does not overlie said chassis.

5. The heat exchanger of claim 1 further comprising a coolant supply pipe with an outlet for each said duct.

6. The heat exchanger of claim 5 further comprising openable blank-off plates over each said pipe outlet that are opened by said modules and that stop the coolant from flowing therethrough when closed.

7. The heat exchanger of claim 1 further comprising a coolant distribution cover on said plural modules overlying each said duct for effecting movement of the coolant through each said duct.

8. The heat exchanger of claim 7 wherein said cover comprises a pump for the coolant.

9. The heat exchanger of claim 7 wherein said cover comprises openable blank,off plates that are opened by said modules and that stop the coolant from flowing therethrough when closed.

10. A module for carrying electronic components and for conducting heat therefrom, said module being carried on a chassis for a heat exchanger that includes a system for conveying a coolant to said module to conduct heat therefrom, said module comprising:

a thermally conductive plate for carrying the electronic components, said plate having two opposing edges;

a heat transfer duct at each of said edges, each said heat transfer duct having openings for conveying a heat transfer fluid therethrough along one of said edges to conduct heat from said plate,

said plate and said heat transfer duct being integrally formed to thereby create an uninterrupted thermal path for conducting heat away from electronic components carried by said plate to interior surfaces of each said heat transfer duct,

wherein at least one said duct comprises two coolant conduits separated by an extension of said plate through said duct.

11. The module of claim 10 further comprising plural fins affixed to said extension for facilitating conduction of heat from said duct to the coolant.

12. A heat exchanger for electronic components comprising a coolant distributor, a coolant distributor cover and plural modules removably mounted on a chassis, each of said modules having its own coolant ducts attached to opposing edges thereof that are in communication with said coolant distributor cover that overlies said plural modules such that the coolant passing through any one duct does not pass through any of the other ducts.

13. The heat exchanger of claim 12 further comprising means for tailoring the cooling capability of said coolant ducts to the heat that is to be conducted from the electronic components.

14. The heat exchanger of claim 12 wherein said chassis comprises receptacles for holding said modules, and wherein said modules have widths so that the number of modules per receptacle may be selectively varied.

15. The heat exchanger of claim 14 wherein the widths of selected ones of said modules is twice the receptacle size so that one of said modules may be held in two of said receptacles.

16. A method of mounting and cooling electronic components carried on modules comprising the steps of:

providing each of the modules with a thermally conductive core for mounting the electronic components;

providing a thermal transfer duct at an edge of the core, the duct and the core forming a thermal path from the electronic components to an interior surface of the duct;

providing the duct with two coolant conduits separated by an extension of the core through the duct;

providing plural fins in the duct for facilitating conduction of heat to a coolant in the duct;

removably attaching the modules to a chassis having a mounting surface; and

conveying the coolant through the duct to thereby cool the electronic components.

17. The method of claim 16 further comprising the step of affixing the fins to the extension of the core.

18. The method of claim 16 further comprising the step of providing each module with two ducts, one on each of two opposing edges of the core.

19. The method of claim 16 further comprising the step of attaching a coolant supply pipe with an openable outlet for each duct.

20. The method of claim 19 further comprising the step of opening the outlet when the module is attached to the chassis.

21. The method of claim 16 further comprising the step of attaching a coolant distribution cover on the modules overlying each the duct for effecting movement of the coolant through the duct.