Solder preform pick-and-place machine and operation

• US 5,482,198 A
• Filed: 01/14/1994
• Issued: 01/09/1996
• Est. Priority Date: 12/04/1992
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Kohn, Harold
• Primary Examiner(s): HEINRICH, SAMUEL M
• Application Number:
  US08/182,902
• Time in Patent Office: 725 Days
• Field of Search: 228/6.2, 228/44.7, 228/49.5, 228/56.3
• US Class Current: 228/6.2
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 3/08 Auxiliary devices therefor cleaning pipes or tubes or systems of pipes or tubes, e.g. before soldering, B08B9/02
• CPC Class Codes: H05K 3/3478 Applying solder preforms; Transferring prefabricated solder patterns
• CPC Class Codes: Y10S 206/821 Stacking member

Abstract

Ten holders containing preforms are stacked on a rectangular bottom frame with different sized threaded posts of the bottom frame extending up through the hole and slot in opposite corners of each holder. An empty holder and then a dust cover with apertures at opposite corners are similarly stacked on the bottom frame to hold and protect the preforms. A top frame with apertures at opposite corners is positioned on the posts. The stack is compressed between the top frame and the bottom frame by screwing nuts onto the threaded posts to form a carrier in which the cavities are sized relative to the preforms to hold the preforms in position during transport to a pick-and-place machine without contaminating or damaging the delicate coating of dry flux. The holders are unstacked and positioned on different sized posts extending upward from a pick-and-place machine. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering. The circuit board can be used without cleaning with solvents or CFC'"'"'s, thus reducing process steps and reducing environmental hazards.

Claims

1. A solder-preform pick-and-place machine comprising:

vacuum means for automatically and sequentially for each solder-preform of a two dimensional stationary array of preforms, applying vacuum and moving vertically for picking the solder-preform up from a respective position of the solder-preform holder, moving in two horizontal axis to a selected position above a stationary circuit board, and moving vertical and controlling the vacuum for placing the preform at a predetermined respective position on the circuit board accurately in horizontal directions as well as rotationally;

post means for accurately positioning the solder-preform holder in relation to the vacuum means in a stationary position for picking up a solder-preform from each position of a two dimensional array of positions of the holder and accurately placing the preform on a stationary circuit board.

2. The machine of claim 1, in which the machine further comprises:

a solder-preform holder with cavities having sidewall angles sufficiently large to provide self-centering of the solder-preforms in the cavities due to vibration during operation of the machine to provide accurate placement of the preforms within a few mils without utilizing a measurement system.

3. The machine of claim 1, in which the machine further comprises:

a table with multiple locations for solder-preform holders which can be rotated between a fixed position for each holder location to allow solder-preforms to be picked from each respective location to provide for unattended operation for extended periods and in which empty holders can be replaced with full holders while the pick-and-place machine operates on a different holder for preventing delays in operation.

4. The machine of claim 1, in which the vacuum means include a robot arm with an elastomer surfaced vacuum pickup which automatically and sequentially picks up solder-preforms from a holder and places the preforms on the circuit boards.

5. The machine of claim 1 further comprising heating means for reflowing the solder-preforms.

6. The machine of claim 5 in which the heating means includes an IR heater for the circuit board and an induction heater for the components.

7. A solder-preform pick-and-place machine, comprising:

vacuum means for automatically and sequentially picking solder-preforms up from each respective cavity of a solder-preform holder and for placing the preforms on circuit boards;

post means for accurately positioning the solder-preform holder in relation to said solder-preform picking means for picking up a solder-preform from each cavity of an array of cavities of the holder and accurately placing the preform on a circuit board;

a table with multiple locations for solder-preform holders which can be rotated to allow solder-preforms to be picked from each respective location to provide for unattended operation for extended periods and in which empty holders can be replaced with full holders while the pick-and-place machine operates for preventing delays in operation;

and in which;

vacuum means include a robot arm with an elastomer surfaced vacuum pickup which automatically and sequentially picks up solder-preforms from a holder and places the preforms on the circuit boards; and

at least two posts are positioned at every solder-preform holder location on the table for insertion through apertures in opposite corners of the holders to accurately position the holders.

8. The machine of claim 7 in which each of the two posts at each holder location are of a substantially different cross section for restricting the holder position to a single correct orientation.

9. A solder-preform pick-and-place machine comprising:

a solder-preform holder having cavities for solder-preforms, with sidewall angles sufficiently large to provide highly accurate self-centering of preforms in the cavities due to vibration during operation of the machine;

vacuum means for automatically and sequentially picking the accurately centered solder-preforms up from each respective cavity of a solder-preform holder and for accurately placing the preforms on circuit boards;

post means for accurately positioning the solder-preform holder in relation to said solder-preform picking means for picking up a solder-preform from each cavity of the holder and accurately placing the preforms on a circuit board.

10. The machine of claim 9 in which:

the cavities form a two dimensional matrix of solder-preform positions;

the machine further comprises means for holding the solder-preform holder in a fixed position relative to the circuit board to which the solder-preforms are transferred to an array of different locations during the transfer of solder-preforms; and

the vacuum means includes robot arm means for moving a vacuum pick biaxially for sequentially moving to each preform holder position to pick up a solder-preform and then moving to a selected position of the circuit board for placing the solder-preform.