Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same
First Claim
1. A process for forming a light-emitting device that comprises an organic LED array containing a plurality of light emitting pixels having a pitch;
- a plurality of light transmissive first electrode elements located on a common electrically insulative transparent substrate, each first electrode element being laterally spaced and electrically insulated from an adjacent first electrode element;
an organic electroluminescent medium located on a supporting surface formed by the substrate and every first electrode element; and
a second electrode element located on said organic electroluminescent medium, said pixels each including a first electrode element and a second electrode element, which comprises the following steps;
(a) releasably laminating to an ultra thin electrically insulating transparent substrate a relatively thick rigid temporary support wherein the ultra thin electrically insulating transparent substrate has a thickness less than the pitch of said pixels;
(b) forming said organic LED array on said ultra thin substrate;
(c) forming on a relatively thick rigid permanent support an electrical conductor patterned in conformity with said first and second electrode elements located on said ultra thin substrate;
(d) forming an array of electrically conductive malleable bonding bumps on said patterned electrical conductor located on said permanent support;
(e) aligning said first and second electrode elements located on said ultra thin substrate in correct registration with said patterned conductor located on said permanent support;
(f) contacting said bonding bumps on said conductor with said first electrode and second electrode elements;
(g) forming a physical and electrical connection between said bonding bumps and said first electrode and second electrode elements; and
(h) delaminating said temporary support from said ultra thin transparent substrate.
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Abstract
A light emitting device that comprises an organic LED array containing a plurality of light emitting pixels, the pixels each being located on a common electrically insulative transparent substrate, is characterized in that the transparent support is ultra thin, having a thickness less than the pitch of the pixels. The pixels in the LED array can be arranged in intersecting columns and rows, or they can comprise a line array. A process for forming a light emitting device on an ultra thin transparent substrate comprises the following steps: (a) releasably laminating to an ultra thin electrically insulating transparent substrate a relatively thick rigid temporary support; (b) forming the LED array on the ultra thin substrate; (c) forming on a relatively thick rigid permanent support an electrical conductor patterned in conformity with the first electrode element and the second electrode element on the ultra thin substrate; (d) forming an array of electrically conductive malleable bonding bumps on the patterned electrical conductor located on the permanent support; (e) aligning the first and second electrode elements in correct registration with the patterned electrical conductor; (f) contacting the bonding bumps on the electrical conductor with the first and second electrode elements; (g) forming a physical and electrical connection between the bonding bumps and the first and second electrode elements; and (h) delaminating the temporary support from the ultra thin transparent substrate. Additionally, a transparent and electrically insulative sealant material can be introduced into the space between the ultra thin substrate and the electrical conductor on the permanent support.
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Citations
20 Claims
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1. A process for forming a light-emitting device that comprises an organic LED array containing a plurality of light emitting pixels having a pitch;
- a plurality of light transmissive first electrode elements located on a common electrically insulative transparent substrate, each first electrode element being laterally spaced and electrically insulated from an adjacent first electrode element;
an organic electroluminescent medium located on a supporting surface formed by the substrate and every first electrode element; and
a second electrode element located on said organic electroluminescent medium, said pixels each including a first electrode element and a second electrode element, which comprises the following steps;(a) releasably laminating to an ultra thin electrically insulating transparent substrate a relatively thick rigid temporary support wherein the ultra thin electrically insulating transparent substrate has a thickness less than the pitch of said pixels; (b) forming said organic LED array on said ultra thin substrate; (c) forming on a relatively thick rigid permanent support an electrical conductor patterned in conformity with said first and second electrode elements located on said ultra thin substrate; (d) forming an array of electrically conductive malleable bonding bumps on said patterned electrical conductor located on said permanent support; (e) aligning said first and second electrode elements located on said ultra thin substrate in correct registration with said patterned conductor located on said permanent support; (f) contacting said bonding bumps on said conductor with said first electrode and second electrode elements; (g) forming a physical and electrical connection between said bonding bumps and said first electrode and second electrode elements; and (h) delaminating said temporary support from said ultra thin transparent substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
- a plurality of light transmissive first electrode elements located on a common electrically insulative transparent substrate, each first electrode element being laterally spaced and electrically insulated from an adjacent first electrode element;
Specification