Pad condition and polishing rate monitor using fluorescence

• US 5,483,568 A
• Filed: 11/03/1994
• Issued: 01/09/1996
• Est. Priority Date: 11/03/1994
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yano, Hiroyuki, Okumura, Katsuya
• Primary Examiner(s): Porta, David P.
• Assistant Examiner(s): WONG, DON KITSUN
• Application Number:
  US08/335,384
• Time in Patent Office: 432 Days
• Field of Search: 216/85, 216/86, 156/626.1, 156/627.1, 451/6, 451/8, 378/44, 378/50, 378/47, 378/54, 378/53, 378/58, 378/83, 378/88, 378/89
• US Class Current: 438/16
• CPC Class Codes: B24B 37/005 Control means for lapping machines or devices
• CPC Class Codes: H01L 21/3212 by chemical mechanical polishing [CMP]

Abstract

The invention is directed to a method for detecting the chemical mechanical polishing rate of a surface of a semi-conductor wafer. In chemical mechanical polishing, a slurry made of abrasive particles suspended in a chemically abrasive liquid is dispensed on the surface of a rotating polishing pad. The wafer to be polished is rotated and lowered into contact with the rotating polishing pad. The method includes directing an X-ray beam at an exposed surface area of the polishing pad, and detecting the intensity of the X-ray fluorescence which results from the beam illuminating the pad. Since both the CMP rate of removal of a wafer surface and the intensity of the X-ray fluorescence are functions of the density of the abrasive particles in the slurry, the CMP rate of removal can be expressed as a function of the density. Accordingly, the detected intensity of the X-ray fluorescence can be converted directly into the CMP rate, without interfering with the CMP process.

Claims

1. A method for determining the polishing rate during abrasive polishing of the surface of a semi-conductor wafer in which a slurry including a liquid having a suspension of abrasive particles is sprayed upon a surface of a rotating polishing pad and a rotating semi-conductor wafer is brought into contact with the surface of the polishing pad, a portion of the surface of the pad exposed during contact, the method comprising:

directing electromagnetic radiation onto the exposed surface of the pad;

detecting the intensity of the electromagnetic radiation produced due to the electromagnetic radiation being directed upon the pad; and

converting the detected intensity into a polishing rate of removal of the surface of the wafer by utilizing a predetermined functional relationship between the intensity and the polishing rate.

2. The method recited in claim 1, the electromagnetic radiation comprising a beam which stimulates fluorescence in the slurry such that the intensity of the fluorescence is detected.

3. The method recited in claim 2, the beam comprising an X-ray beam and the fluorescence comprising X-ray fluorescence.

4. The method recited in claim 3, wherein, the abrasive polishing is chemical mechanical polishing.

5. The method recited in claim 4, wherein, the converting step includes utilizing a predetermined functional relationship between the intensity and the density of removed material from the wafer in the slurry and between the polishing rate and the density of removed materials in the slurry.

6. The method recited in claim 5, wherein, the removed material is SiO₂.

7. The method recited in claim 4, wherein, the converting step includes utilizing a predetermined functional relationship between the intensity and the density of the abrasive particles in the slurry and between the polishing rate and density of abrasive particles in the slurry.

8. The method recited in claim 7, wherein, the abrasive particles are CeO₂ and the liquid includes water.

9. The method recited in claim 3, wherein, the liquid includes water and the abrasive particles include CeO₂.

10. A method for performing abrasive polishing comprising:

rotating a polishing pad and spraying a slurry including a liquid having a suspension of abrasive particles onto a surface of the pad;

rotating a semi-conductor wafer and bringing the rotating wafer into contact with the surface of the pad with an area of the surface of the pad exposed during contact;

directing electromagnetic radiation at the exposed surface area of the pad;

detecting the intensity of the electromagnetic radiation produced due to the electromagnetic radiation being directed upon the pad; and

converting the detected intensity into a polishing rate of removal of the surface of the wafer by utilizing a predetermined functional relationship between the intensity and the polishing rate.

11. The method recited in claim 10, the electromagnetic radiation comprising a beam which stimulates fluorescence in the slurry such that the intensity of the fluorescence is detected.

12. The method recited in claim 11, the beam comprising an X-ray beam and the fluorescence comprising X-ray fluorescence.

13. The method recited in claim 12, wherein, the liquid is water and the abrasive particles are CeO₂.

14. The method recited in claim 12, wherein, the abrasive polishing is chemical mechanical polishing.

15. The method recited in claim 14, wherein, the liquid is a base.

16. The method recited in claim 14, wherein, the liquid is an acid.

17. An apparatus for determining the polishing rate during abrasive polishing of the surface of a semi-conductor wafer in which a slurry including a liquid having a suspension of abrasive particles is sprayed upon a surface of a rotating polishing pad and a rotating semi-conductor wafer is brought into contact with the surface of the polishing pad with a portion of the surface of the pad exposed during contact, the apparatus comprising:

means for directing electromagnetic radiation at the exposed surface of the pad;

means for detecting the intensity of the electromagnetic radiation produced due to the electromagnetic radiation being directed upon the pad; and

means for converting the detected intensity into a polishing rate of removal of the surface of the wafer.

18. The apparatus recited in claim 17, the electromagnetic radiation comprising a beam which stimulates fluorescence in the slurry such that the intensity of the fluorescence is detected.

19. The apparatus recited in claim 18, the beam comprising an X-ray beam and the fluorescence comprising X-ray fluorescence.

20. The apparatus recited in claim 19, said means for converting comprising means for storing a predetermined functional relationship between the intensity and the polishing rate, and means for applying the stored functional relationship to the detected intensity to determine the polishing rate.

21. The apparatus recited in claim 19, said means for directing comprising an X-ray tube and said means for detecting comprising an X-ray spectrometer.

22. A semi-conductor workpiece processing machine comprising:

a rotatable workpiece carrier, the rotating motion of the carrier being imparted to a workpiece carried thereon;

a rotatable polishing pad having an upper surface, said carrier and pad relatively movable to allow the workpiece to be brought into contact with said pad, said pad having a larger surface area than the workpiece so as to leave a surface of the pad exposed when the workpiece is in contact with said pad;

a slurry dispenser disposed to dispense slurry upon the upper surface of said pad;

an X-ray tube disposed to direct an X-ray beam at the exposed surface area of the pad;

an X-ray spectrometer, said spectrometer receiving the fluorescence reflected from the pad and determining the intensity thereof; and

means for converting the intensity of the reflected beam into a polishing rate of removal of the surface of the wafer and for providing a readout of the rate.

23. A method for performing abrasive polishing comprising:

rotating a polishing pad and spraying a slurry including a liquid having a suspension of abrasive particles onto a surface of the pad

rotating a semi-conductor wafer and bringing the rotating wafer into contact with the surface of the pad with an area of the surface of the pad exposed during contact;

directing electromagnetic radiation at the exposed surface area of the pad;

detecting the intensity of the electromagnetic radiation produced due to the electromagnetic radiation being directed upon the pad; and

terminating polishing when, after the detected intensity has first reached a substantially steady level, the intensity undergoes a reduction to a level which is less than a predetermined level.