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Automated diagnosis using wafer tracking databases

  • US 5,483,636 A
  • Filed: 03/29/1995
  • Issued: 01/09/1996
  • Est. Priority Date: 02/03/1993
  • Status: Expired due to Term
First Claim
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1. An automated method for isolating one or more causes of misprocessing in a semiconductor process comprising the steps of:

  • a. processing a plurality of wafers;

    b. measuring a plurality of process parameters during said processing for each of said plurality of wafers;

    c. creating a wafer tracking database which contains said plurality of process parameters and a plurality of identifying information associated with each wafer;

    d. generating a first plurality queries wherein each query in said first plurality of queries corresponds to at least one of said plurality of process parameters;

    e. applying each query of said first plurality of queries to said wafer tracking database to obtain a set of observations for each query of said first plurality of queries;

    f. automatically determining from a pattern of each of said set of observations whether each query of said first plurality of queries is interesting for fault isolation;

    g. dividing said first plurality of queries into a second plurality of queries wherein said second plurality contains queries determined to be interesting for fault isolation; and

    h. displaying said second group of queries so that at least one cause of misprocessing can be determined.

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