×

System and method for real-time control of semiconductor a wafer polishing, and a polishing head

  • US 5,486,129 A
  • Filed: 08/25/1993
  • Issued: 01/23/1996
  • Est. Priority Date: 08/25/1993
  • Status: Expired due to Term
First Claim
Patent Images

1. A system for polishing a semiconductor wafer comprising:

  • a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen rotatable about a first axis, a polishing head which supports the semiconductor wafer for rotation about a second axis, and a polishing head displacement mechanism which moves the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that upon variation change the polishing rate and polishing uniformity;

    a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly;

    a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller; and

    the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×