Device for conditioning polishing pads

• US 5,486,131 A
• Filed: 01/04/1994
• Issued: 01/23/1996
• Est. Priority Date: 01/04/1994
• Status: Expired due to Term

• Current Assignee: SpeedFam-Ipec Corporation (Lam Research Corporation)
• Original Assignee: Speedfam Corporation (Lam Research Corporation)
• Inventors: Van Woerkom, Anthony G., Cesna, Joseph V.
• Primary Examiner(s): Kisliuk, Bruce M.
• Assistant Examiner(s): Morgan, Eileen P.
• Application Number:
  US08/177,156
• Time in Patent Office: 749 Days
• Field of Search: 51/54, 51/55, 51/56 R, 51/67, 51/117, 51/118, 51/123 R, 51/129, 51/131.1, 51/131.3, 51/131.4, 51/262 R, 51/262 T, 51/262 A, 51/5 B, 51/5 C , 51/5 D, 51/236, 51/240 T, 51/237 R, 51/325, 451/548, 451/550, 451/41, 451/56
• US Class Current: 451/56
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/10 of travelling flexible backings coated with abrasives; Cleaning of abrasive belts

Abstract

A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.

Claims

1. A process for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis which comprises while said polishing pad is being rotated bringing under pressure into contact with the top exposed surface of said polishing pad and oscillating over the said pad surface a carrier element adapted for vertical movement into and out of substantially perpendicular engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element being in the shape of a ring and carrying on its bottom surface cutting means disposed in a circular ring configuration for truing and dressing the polishing pad by contact therewith.

2. A process in accordance with claim 1 wherein the carrier element is provided with spaced cut-out portions along its periphery to permit materials to escape from the interior of the carrier element.

3. A process in accordance with claim 1 wherein the cutting means comprises diamond particles.

4. A process in accordance with claim 3 in which the diamond cutting means have a particle size of not larger than about 60 mesh, U.S. Sieve Series.

5. A process in accordance with claim 1 wherein the cutting elements comprise a blade having cutting teeth thereon.

6. A device for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a carrier element adapted for vertical substantially perpendicular movement into and out of engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element having a ring-shaped flange downwardly depending from its bottom surface carrying cutting means for truing and dressing the polishing pad by contact therewith.

7. A device in accordance with claim 6 having spaced cut-out portions along the periphery of the flange element to permit materials to escape from the interior of the carrier element.

8. A device in accordance with claim 6 wherein the cutting means comprises diamond particles.

9. A device in accordance with claim 8 in which the diamond cutting means have a particle size of not larger than about 80 mesh, U.S. Sieve Series.

10. A device in accordance with claim 6 wherein the cutting means comprise a circular blade having cutting teeth thereon.