Thermal imaging system with integrated thermal chopper

• US 5,486,698 A
• Filed: 04/19/1994
• Issued: 01/23/1996
• Est. Priority Date: 04/19/1994
• Status: Expired due to Term

• Current Assignee: L-3 Communications Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Texas Instruments, Inc.
• Inventors: Hanson, Charles M., Robinson, James E., Dudley, Dana
• Primary Examiner(s): Hannaher, Constantine
• Application Number:
  US08/229,497
• Time in Patent Office: 644 Days
• Field of Search: 250/338.3, 250/351, 250/350, 250/338.1, 250/332
• US Class Current: 250/332
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/0245 for performing thermal shunt
• CPC Class Codes: G01J 5/10 using electric radiation detectors
• CPC Class Codes: G01J 5/48 Thermography; Techniques using wholly visual means
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

A thermal imaging system (10) contains a focal plane array (14) including a plurality of thermal sensors (50) mounted on a substrate (52). The focal plane array (14) generates both a reference signal which represents the temperature of the substrate (52) and a biased signal corresponding to the total radiance emitted by a scene (11). Electronics (16) process the reference signal and the biased signal to obtain an unbiased signal representing radiance differences emitted by objects in the scene (11). A thermoelectric cooler/heater (38) may be provided to optimally adjust the temperature of the substrate (52) to improve overall image quality. Each thermal sensor (50) contains an electrode (66 and 68) that electrically couples the thermal sensor (50) to the substrate (52) and also allows the thermal sensor (50) to deflect, contact, and thermally shunt with the substrate (52).

Claims

1. A thermal sensor mounted on a substrate to provide a signal representative of the amount of thermal radiation incident to the thermal sensor, comprising:

thermal sensitive material for generating a biased signal representing total radiance from the scene and for generating a reference signal by shunting the thermal sensitive material with the substrate;

at least one flexible arm for allowing selective deflection of the thermal sensitive material to contact the substrate and form the reference signal; and

a signal flow path from the thermal sensitive material to a respective contact pad disposed on the substrate; and

the signal flow path providing a reference signal representative of the temperature of the substrate when the thermal sensitive material deflects to contact the substrate.

2. The thermal sensor of claim 1, wherein the thermal sensitive material and the signal flow path further comprise:

a common plate;

a pair of thermally sensitive pixel elements, each pixel element electrically coupled on one side with the common plate and on the other side with a respective electrode;

a bias electrode for coupling one pixel element to a bias contact pad disposed on the substrate and for supplying a bias voltage to the thermal sensor; and

a signal electrode for coupling the other pixel element to a signal contact pad disposed on the substrate and for receiving the signal from the thermal sensor.

3. The thermal sensor of claim 1, further comprising:

at least one address electrode disposed on the substrate for use in selectively deflecting the thermal sensor; and

at least one landing pad disposed on the substrate for contacting a portion of the deflected thermal sensor, thereby providing thermal coupling between the thermal sensor and the substrate.

4. The thermal sensor of claim 1, further comprising a portion of a radiometer for measuring radiant energy from a selected source.

5. A thermal imaging system for producing an image of a scene, comprising:

optics for focusing radiation emitted by the scene on a focal plane array;

the focal plane array, including a plurality of thermal sensors mounted on a substrate, for generating a biased signal representing the total radiance from the scene and for generating a reference signal by thermally shunting the thermal sensors to the substrate;

electronics for receiving the biased signal and the reference signal and for subtracting the reference signal from the biased signal to obtain an unbiased signal representing radiance differences emitted by objects in the scene; and

a display for receiving the unbiased signal and for displaying an image generated in response to the unbiased signal.

6. The system of claim 5, wherein each of the thermal sensors further comprises a pair of electrodes mounted on the substrate with flexible leads which allow selective deflection of the respective thermal sensor to contact the substrate and form the reference signal.

7. The system of claim 5, wherein the plurality of thermal sensors receive a bias voltage from the substrate and provide a signal to the substrate representative of the amount of thermal radiation incident to the focal plane array.

8. The system of claim 5, wherein the plurality of thermal sensors provide a signal representative of the amount of thermal radiation incident to the focal plane array, each thermal sensor comprising:

a common plate;

a pair of thermally sensitive pixel elements, each pixel element electrically coupled on one side with the common plate and on the other side with a respective electrode;

each electrode coupled to a respective contact pad disposed on the substrate, thereby forming a signal path between the contact pads through the common plate, the pixel elements, and the electrodes; and

each electrode comprising a flexible lead that allows the thermal sensor to deflect and contact the substrate for providing the reference signal representative of the temperature of the substrate.

9. The system of claim 5, further comprising:

a low pass filter for receiving the biased signal and for extracting the DC component of the biased signal representing a signal offset;

a comparator for receiving the signal offset and for comparing the signal offset to a reference offset to obtain a control signal;

an amplifier for receiving the control signal and producing a drive signal; and

a thermoelectric cooler/heater for responding to the drive signal by adjusting the temperature of the substrate, thereby reducing the difference between the signal offset and the reference offset.

10. A focal plane array including a plurality of thermal sensors mounted on a substrate to provide a signal representative of the amount of thermal radiation incident to the focal plane array, each thermal sensor comprising:

a common plate;

a pair of thermally sensitive pixel elements with each pixel element electrically coupled on one side with the common plate and on the other side with a respective electrode;

each electrode coupled to a respective contact pad disposed on the substrate for forming a signal path between the contact pads through the common plate, the pixel elements, and the electrodes; and

each electrode comprising a flexible lead that allows the thermal sensor to deflect and contact the substrate for providing a reference signal representative of the temperature of the substrate.

11. The focal plane array of claim 10, wherein the electrodes for each thermal sensor comprise:

a bias electrode for coupling one pixel element to a bias contact pad disposed on the substrate and for supplying a bias voltage to the thermal sensor; and

a signal electrode for coupling the other pixel element to a signal contact pad disposed on the substrate and for receiving the signal from the thermal sensor.

12. The focal plane array of claim 10, wherein each thermal sensor comprises:

at least one address electrode disposed on the substrate that when activated causes the thermal sensor to selectively deflect; and

at least one landing pad disposed on the substrate for contacting a portion of the deflected thermal sensor, thereby providing thermal coupling between the thermal sensor and the substrate.

13. The focal plane array of claim 10, wherein the pixel elements are formed from a pyroelectric material.

14. The focal plane array of claim 10, wherein a temperature control circuit adjusts the temperature of the substrate.

15. The focal plane array of claim 10, wherein a temperature control circuit adjusts the temperature of the substrate, the temperature control circuit further comprising:

a low pass filter for receiving the signal and for extracting the DC component of the signal representing a signal offset;

a comparator for receiving the signal offset and for comparing the signal offset to a reference offset to obtain a control signal;

an amplifier for receiving the control signal and producing a drive signal; and

a thermoelectric cooler/heater for responding to the drive signal by adjusting the temperature of the substrate, thereby reducing the difference between the signal offset and the reference offset.

16. A method for producing an image of a scene using a thermal imaging system with a plurality of thermal sensors mounted on a substrate, comprising the steps of:

thermally shunting the thermal sensors to the substrate to establish a reference signal representative of the temperature of the substrate;

detecting the thermal radiation from the scene to form a biased signal representing the total radiance of the scene;

subtracting the reference signal from the biased signal to obtain an unbiased signal representing radiance differences emitted by objects in the scene; and

displaying an image in response to the unbiased signal.

17. The method of claim 16, wherein the steps of thermally shunting and detecting are each executed in approximately equal time.

18. The method of claim 16, wherein the steps of thermally shunting and detecting are executed with the detecting time period substantially longer than the shunting time period.

19. The method of claim 16, wherein the step of thermally shunting comprises:

activating at least one address electrode disposed on the substrate for each thermal sensor; and

deflecting each thermal sensor in response to the corresponding activated address electrode until a portion of the thermal sensor contacts at least one landing pad disposed on the substrate.

20. The method of claim 16, wherein the step of detecting further comprises:

deactivating at least one address electrode disposed on the substrate for each thermal sensor; and

returning each thermal sensor to an undeflected state for detecting the thermal radiation from the scene.

21. The method of claim 16, further comprising controlling the temperature of the substrate during the step of detecting, comprising the steps of:

extracting the DC component of the biased signal representing a signal offset;

comparing the signal offset to a reference offset to obtain a control signal; and

driving a thermoelectric cooler/heater in response to the control signal to adjust the temperature of the substrate, thereby reducing the difference between the signal offset and the reference offset.

22. The method of claim 16, further comprising controlling the temperature of the substrate to adjust the reference signal sensed by the thermal sensors.