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Simultaneous capacitive open-circuit testing

  • US 5,486,753 A
  • Filed: 09/08/1994
  • Issued: 01/23/1996
  • Est. Priority Date: 07/30/1993
  • Status: Expired due to Term
First Claim
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1. For testing, on a circuit board on which is mounted a circuit package that houses an integrated circuit and provides IC pins intended to be conductively connected to conductive paths respectively associated therewith on the circuit board, the continuity between a plurality of the IC pins and the conductive board paths respectively associated therewith, a method comprising the steps of:

  • A) applying an AC signal of a different test frequency respectively associated therewith to each of a plurality of the board paths associated with the IC pins;

    B) capacitively sensing the resultant electric-field signal in the vicinity of the circuit package;

    C) determining the contribution of each of the test frequencies to the sensed signal; and

    D) if the contribution of a given test frequency is less than a predetermined threshold associated therewith, generating an indication of a lack of continuity between the board path associated with the given test frequency and the IC pin associated with that board path.

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