Method of making a monolithic magnetic device with printed circuit interconnections

• US 5,487,214 A
• Filed: 10/09/1992
• Issued: 01/30/1996
• Est. Priority Date: 07/10/1991
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Walters, Michael M.
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US07/958,878
• Time in Patent Office: 1,208 Days
• Field of Search: 29/602.1, 29/605, 336/200, 427/96, 427/116, 427/127
• US Class Current: 29/602.1
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49073 by assembling coil and core

Abstract

A monolithic magnetic device having a plurality of transformer elements having single turn primaries and single turn secondaries fabricated on a plate of ferrite which has the outline of a ceramic leadless chip carrier. Each of the magnetic elements has a primary winding formed from a copper via plated on the ferrite. Each element'"'"'s secondary is another copper via plated over an insulating layer formed over the first layer of copper. The elements'"'"' primaries are interconnected on the first copper layer and the elements'"'"' secondaries are interconnected on the second copper layer. The configuration and turns ratio of the transformer are determined by the series and or parallel interconnections of the primary and secondaries. Some of the interconnections can be provided by the next higher assembly level through the circuit card, with the same magnetic device providing many turns ratio combinations or values of inductors.

Claims

1. A method of making a magnetic device for surface mounting on a circuit board comprising the steps of:

forming a plurality of holes through a plate of flux permeable material;

plating a first layer of current conductive material in the holes to form a plurality of first windings passing therethrough, such that each of the holes is disposed about only a single one of the plurality of first windings passing therethrough;

plating on both sides of the plate to interconnect at least a portion of the plurality of first windings;

plating regions on the plate, each of the regions connected to at least a portion of the first windings, for use in surface mounting of the magnetic device;

covering the first layer of current conductive material with an insulating layer; and

plating a second layer of current conductive material in the holes on the insulating layer to form a plurality of second windings passing therethrough, such that each of the holes is disposed about only a single one of the plurality of second windings passing therethrough;

plating on both sides of the plate to interconnect at least a portion of the plurality of second windings; and

plating regions on the plate, each of the regions connected to at least a portion of the second windings, for use in surface mounting the magnetic device.

2. The method of claim 1 wherein said regions are located on one side of said plate.

3. The method of claim 1 wherein said regions are located at the edge of the plate.

4. The method of claim 1 further comprising the step of using solder to attach said magnetic device to a circuit card.

5. The method according to claim 1, wherein the plate of flux permeable material comprises ferrite.

6. The method according to claim 1, wherein the plating steps utilize copper as a plating material.

7. The method according to claim 1, wherein the insulating layer comprises parylene thermoplastic polymer.