Polymeric adhesive paste

• US 5,488,082 A
• Filed: 02/17/1995
• Issued: 01/30/1996
• Est. Priority Date: 07/30/1993
• Status: Expired due to Term

• Current Assignee: Diemat, Inc.
• Original Assignee: Diemat, Inc.
• Inventors: Peck, David M., Dietz, Raymond L.
• Primary Examiner(s): Morgan, Kriellion S.
• Application Number:
  US08/390,257
• Time in Patent Office: 347 Days
• Field of Search: 524/403, 524/440
• US Class Current: 524/403
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C09J 201/00 Adhesives based on unspecified macromolecular compounds
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01038 Strontium [Sr]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01056 Barium [Ba]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12033 : Gunn diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H05K 1/092 : Dispersed materials, e.g. conductive pastes or inks

Abstract

Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.

Claims

1. An adhesive paste consisting essentially of:

(A) about 10-50 volume percent at least one organic polymer resin;

(B) up to about 40 volume percent inorganic filler; and

(C) about 30-65 volume percent fugitive liquid;

wherein each of the resin and the filler is present in particulate form of size sufficiently small to pass through a Number 325 mesh screen, and wherein the liquid and organic polymer resin are each substantially insoluble in the other.

2. An adhesive paste of claim 1 wherein the organic polymer resin consists essentially of thermoplastic polymer.

3. An adhesive paste of claim 1 wherein the organic polymer resin comprises a blend of at least one thermoplastic polymer and at least one second polymer, the second polymer being present in an amount of at least about 5% of the blend.

4. An adhesive paste of claim 1 wherein the second polymer comprises at least one thermosetting polymer.

5. An adhesive paste of claim 4 wherein the second polymer consists essentially of epoxy resin.

6. An adhesive paste of claim 5 wherein the epoxy resin comprises at least about 10 volume percent of the blend.

7. An adhesive paste of claim 1 wherein the fugitive liquid comprises an effective amount of at least one viscosity modifying polymer.

8. An adhesive paste of claim 5 wherein the viscosity modifying polymer comprises about from 0.5 to 5 volume % of the fugitive liquid.

9. An adhesive paste of claim 8 wherein the viscosity modifying polymer comprises less than about 3 volume % of the fugitive liquid.

10. An adhesive paste of claim 7 wherein the viscosity modifying polymer consists essentially of thermoplastic elastomer.

15. An adhesive paste of claim 1 further comprising about from 0.5 to 5 volume %, based on the fugitive liquid, of metal resinate.

16. An adhesive paste of claim 15 wherein the metal resinate is selected from the group consisting of silver resinate and zinc resinate.

17. An adhesive paste of claim 16 wherein the metal resinate consists essentially of silver resinate.

11. An adhesive paste consisting essentially of:

(A) about 10-50 volume percent organic polymer resin;

(B) up to about 40 volume percent inorganic filler; and

(C) about 30-65 volume percent fugitive liquid;

wherein each of the resin and filler is present in particulate form of size sufficiently small to pass through a Number 325 mesh screen, wherein the liquid and thermoplastic polymer are each substantially insoluble in the other; and

wherein the fugitive liquid comprises an effective amount of at least one viscosity modifying polymer to increase the viscosity of the liquid.

12. An adhesive paste of claim 11 wherein the viscosity modifying polymer comprises about from 0.5 to 5 volume % of the fugitive liquid.

13. An adhesive paste of claim 12 wherein the viscosity modifying polymer is selected from the group consisting of thermoplastic elastomer.

14. An adhesive paste of claim 13 wherein the viscosity modifying polymer consists essentially of styrene ethylene propylene block copolymer.

18. An adhesive paste of claim 12 wherein the viscosity modifying polymer is less than about 3 volume % of the fugitive liquid.