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Method of measuring characteristics of a multilayer electronic component

  • US 5,488,765 A
  • Filed: 04/13/1994
  • Issued: 02/06/1996
  • Est. Priority Date: 07/27/1992
  • Status: Expired due to Term
First Claim
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1. A method of measuring characteristics of a multilayer electronic component, comprising the steps of:

  • preparing a mother laminate, Which is capable of being cut along prescribed cutting lines for obtaining a plurality of separate multilayer electronic components, by stacking a plurality of mother insulating sheets;

    the mother sheets having interposed internal circuit elements for forming respective said multilayer electronic components, said internal circuit elements being distributed in respective regions to be parted by said cutting lines;

    the mother sheets further having via holes, coated with conductive materials and being electrically connected with said internal circuit elements, provided in positions to be exposed on cut surfaces to be formed by said cutting along said cutting lines;

    forming grooves partially through said mother laminate along said cutting lines, thereby fully exposing said via holes on inner side surfaces of said grooves but not cutting completely through said mother laminate, thereby forming intermediate multilayer electronic components which are electrically independent of each other while still being mechanically connected; and

    measuring characteristics of at least one said intermediate multilayer electronic component by utilizing said via holes, exposed on said inner side surfaces of said grooves, as external electrodes of said at least one intermediate multilayer electronic component.

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