Substrate having an optically transparent EMI/RFI shield
First Claim
1. A substrate having an optically transparent EMI/RFI shield, comprising:
- a substrate having a thin film metallization pattern on a major surface; and
an optically transparent EMI/RFI shield comprising a vapor deposited layer of indium-tin oxide on the substrate major surface and on the metallization pattern, the shield patterned to reveal a first portion of the metallization pattern and to cover a second portion of the metallization pattern.
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Accused Products
Abstract
A substrate having an optically transparent EMI/RFI shield. A transparent substrate (10) has a thin film metallization pattern (20) on one surface, and some of the pattern is covered with an optically transparent EMI/RFI shield (32). The shield comprises a vapor deposited layer of indium-tin oxide on the substrate surface and on the metallization pattern. The indium-tin oxide is optically transparent. It is patterned to expose one portion (34) of the metallization pattern and to cover a second portion (32) of the metallization pattern. The shield is electrically connected to a part (26) of the metallization pattern that is covered, thus providing electrical shielding and transparency.
40 Citations
7 Claims
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1. A substrate having an optically transparent EMI/RFI shield, comprising:
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a substrate having a thin film metallization pattern on a major surface; and an optically transparent EMI/RFI shield comprising a vapor deposited layer of indium-tin oxide on the substrate major surface and on the metallization pattern, the shield patterned to reveal a first portion of the metallization pattern and to cover a second portion of the metallization pattern. - View Dependent Claims (2, 3, 4, 5, 7)
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6. A substrate for a flip-chip, having an optically transparent EMI/RFI shield, comprising:
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a substrate having a thin film metallization pattern on a major surface, the pattern comprising a layer of vapor deposited chrome on the substrate, a second layer of copper on the chrome, and a third layer of gold on the copper; an optically transparent EMI/RFI shield comprising; an indium-tin oxide layer vapor deposited on the substrate major surface and on a first portion of the metallization pattern; the indium-tin oxide layer electrically connected to the first portion of the metallization pattern; and the indium-tin oxide layer revealing a second portion of the metallization pattern; and an electronic device electrically attached to the second portion of the metallization pattern.
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Specification