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Direct bonding of copper composites to ceramics

  • US 5,490,627 A
  • Filed: 06/30/1994
  • Issued: 02/13/1996
  • Est. Priority Date: 06/30/1994
  • Status: Expired due to Fees
First Claim
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1. A process for direct bonding a ceramic to a copper composite, said process comprising the steps of:

  • heating a copper composite substrate to a first temperature at which copper diffuses to a region adjacent the surface of said substrate,oxidizing said substrate after heating,placing a ceramic member in contact with the resulting oxidized substrate in an inert atmosphere at a second temperature sufficient to produce a copper-copper oxide eutectic at the interface between said oxidized substrate and said ceramic member, said eutectic, upon cooling, forming a bond between said ceramic and said copper composite.

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