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Probe and electrical part/circuit inspecting apparatus as well as electrical part/circuit inspecting method

  • US 5,491,427 A
  • Filed: 08/10/1994
  • Issued: 02/13/1996
  • Est. Priority Date: 08/21/1993
  • Status: Expired due to Fees
First Claim
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1. An apparatus for probing semiconductor devices having terminal comprising:

  • a substrate (1) having a surface;

    probe electrodes (B) disposed on the surface of the substrate, wherein the electrodes are arranged on the surface of the substrate in a plurality of columns for probing the semiconductor device, each probing column extending outwardly from a central portion of the substrate surface towards a perimeter of the substrate surface; and

    means (6;

    S1-S10;

    S) for electrically coupling probe electrodes with a test system in such a way so as to provide the devices to be probed with a selection of more than two arrangements in which device terminals contacting the probe electrodes are not shorted with each other by the coupling means, wherein the coupling means includes a plurality of line patterns (6), each line electrically interconnecting the electrode of a respective one of the probing columns, wherein the probe electrodes are arrayed in a grid pattern at contacting regions with the device to be probed by a signal path switching means (S1-S10;

    S), and wherein said probe electrode and signal path switching means are both formed on the substrate.

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