Probe and electrical part/circuit inspecting apparatus as well as electrical part/circuit inspecting method

• US 5,491,427 A
• Filed: 08/10/1994
• Issued: 02/13/1996
• Est. Priority Date: 08/21/1993
• Status: Expired due to Fees

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Kondoh, You, Ueno, Toshiaki
• Primary Examiner(s): Wieder, Kenneth A.
• Assistant Examiner(s): WARDAS, MARK A
• Application Number:
  US08/288,514
• Time in Patent Office: 552 Days
• Field of Search: 324/72.5, 324/754, 324/158.1
• US Class Current: 324/750.16
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film
• CPC Class Codes: G01R 1/07364 with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch

Abstract

An apparatus and method for providing durable, high performance, probing of semiconductor devices having a large number of narrow pitch terminals. A single probe of the present invention provides flexible probing of a wide range of the devices having various sizes and terminal arrangements. In contrast, teachings of the prior art require a separate probe to be manufactured or a probe to be re-formed for each different size and terminal arrangement of the devices. The probe of the invention includes electrodes electrically coupled with a test system in such a way so as to provide the devices to be probed with a selection of more than two arrangements in which device terminals contacting the probe electrodes are not shorted with each other by the probe.

Claims

1. An apparatus for probing semiconductor devices having terminal comprising:

a substrate (1) having a surface;

probe electrodes (B) disposed on the surface of the substrate, wherein the electrodes are arranged on the surface of the substrate in a plurality of columns for probing the semiconductor device, each probing column extending outwardly from a central portion of the substrate surface towards a perimeter of the substrate surface; and

means (6;

S1-S10;

S) for electrically coupling probe electrodes with a test system in such a way so as to provide the devices to be probed with a selection of more than two arrangements in which device terminals contacting the probe electrodes are not shorted with each other by the coupling means, wherein the coupling means includes a plurality of line patterns (6), each line electrically interconnecting the electrode of a respective one of the probing columns, wherein the probe electrodes are arrayed in a grid pattern at contacting regions with the device to be probed by a signal path switching means (S1-S10;

S), and wherein said probe electrode and signal path switching means are both formed on the substrate.

2. An apparatus as in claim 1 further comprising:

means (3) for aligning the electrodes disposed on the substrate surface with the device terminals so as to select a respective probing column for each terminal of the device; and

means (2) for pressing a respective selected electrode into electrical contact with each terminal of the device, so as to provide electrical coupling between each device terminal and the respective selected probing column.

3. An apparatus as in claim 1 wherein said signal path switching means is a semiconductor switch or a mechanical switch (31, 32, 33, 34, 35) fabricated by a micro-machining technology.

4. An apparatus as in claim 1 wherein said signal path switching means is constructed so that it opens a signal path by melting.

5. An apparatus as in claims 1 wherein the substrate comprises an insulative flexible synthetic resin film having a front surface coupled with the electrodes.

6. An apparatus as in claim 5, further comprising an elastic body mechanically coupled with a rear surface of the insulative flexible synthetic resin film.