Electronic package having active means to maintain its operating temperature constant

• US 5,491,610 A
• Filed: 09/09/1994
• Issued: 02/13/1996
• Est. Priority Date: 09/09/1994
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Mok, Lawrence S.-W., Purushothaman, Sampath, Wu, Tien Y., Wilczynski, Janusz S., Sammakia, Bahgat G.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/303,804
• Time in Patent Office: 522 Days
• Field of Search: 165/3, 165/22, 165/26-27, 165/32, 165/34, 165/40, 165/58, 165/80.2, 165/80.3, 165/185, 174/16.3, 236/49.3, 236/94, 236/DIG. 3, 313/13, 361/687-688, 361/695-697, 361/717-722
• US Class Current: 361/695
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

An electronic package having an active cooling system for maintaining a semiconductor chip at approximately a constant temperature by monitoring the present temperature of the chip and varying the air flow over a heat sink in thermal contact with the chip in response to the temperature. In addition, the temperature difference between the semiconductor chip module and a printed circuit board is also monitored to maintain that difference at a preset value. The air flow is varied by a variable speed fan or a variable direction baffle.

Claims

1. An apparatus for actively cooling a semiconductor chip module comprising:

a semiconductor chip module secured to a printed circuit board;

a heat sink thermally secured to said module;

variable air flow means for directing air flow over said heat sink;

means for monitoring the temperature difference between the module and the printed current board; and

control means for connecting the means for monitoring the temperature difference between the module and the printed circuit board and the variable air flow means to regulate the air flow to maintain the temperature difference at a preset value.

2. The apparatus of claim 1 wherein said variable air flow means is a variable speed fan.

3. The apparatus of claim 1 wherein said variable air flow means is a variable direction baffle and a fan.

4. The apparatus of claim 1 wherein said means for monitoring the temperature difference between the module and the printed circuit board module is a separate temperature sensor in thermal contact with each of said module and board.

5. The apparatus of claim 1 wherein said means for monitoring the temperature difference between the module and the printed circuit board including a temperature sensor in thermal contact with said board and means for sensing the supply current to a semiconductor chip attached to said module.

6. The apparatus of claim 1 further including means for monitoring the temperature of a semiconductor chip mounted in said module and wherein said control means also regulates the air flow to maintain the chip temperature at a substantially constant temperature.

7. A method for actively cooling a semiconductor chip module comprising the steps of:

monitoring the temperature difference between a semiconductor chip module and a printed circuit board on which the module is mounted; and

varying the air flow over a heat sink in thermal contact with said module in response to said temperature difference to maintain said temperature difference at a preset value.

8. The method of claim 7 wherein the step of varying the air flow over a heat sink includes varying the speed of a variable speed fan.

9. The method of claim 7 wherein the step of varying the air flow over a heat sink includes varying the direction of a baffle position between the heat sink and a fan.

10. The method of claim 7 further including the step of monitoring the present temperature of a chip attached to said module and varying the air flow over the heat sink to maintain the temperature of the chip at a substantially constant temperature.