Capacitive melt pressure measurement with center-mounted electrode post

• US 5,492,016 A
• Filed: 12/14/1993
• Issued: 02/20/1996
• Est. Priority Date: 06/15/1992
• Status: Expired due to Fees

• Current Assignee: Gefran SPA (Fingefran Srl)
• Original Assignee: Industrial Sensors Incorporated
• Inventors: Carr, Robert B., Pinto, Gino A., Frusztajer, Boruch B., Eggleston, Gerard, Lawhite, Leif E.
• Primary Examiner(s): Chilcot, Richard
• Assistant Examiner(s): FELBER, JOSEPH LEON
• Application Number:
  US08/162,167
• Time in Patent Office: 798 Days
• Field of Search: 73/708, 73/718, 73/724, 73/756, 361/283.3, 361/283.4
• US Class Current: 73/724
• CPC Class Codes: G01L 19/04 Means for compensating for effects of changes of temperature , i.e. other than electric compensation
• CPC Class Codes: G01L 9/0072 using variations in capacitance
• CPC Class Codes: G01L 9/125 with temperature compensating means non electric temperature compensating means G01L19/04

Abstract

A melt pressure measurement probe for insertion through wall of melt-containing vessel has a pressure-deflectable end portion for contact with pressurized melt. Pressure-resistant securing means fixes the end surface in a non-flow obstruction relationship. A seal surface on the probe prevents exposure of the melt to the securing means. Pressure detection means internal of the probe, responsive to deflection of the probe end surface to detect melt pressure, comprises a temperature-compensated capacitive sensor, one capacitor plate defined by the end portion and an opposite capacitor plate in the probe with a capacitive gap in-between. Electronic circuitry remote from the melt-exposed end, including circuitry within the probe to generate a signal proportional to the capacitance, compensates for change of temperature of the capacitor to generate an output signal proportional to melt pressure.

Claims

1. A melt pressure measurement device for measuring the pressure of a melted substance useful in cooled state for forming solid objects, the device comprising a probe for insertion through an aperture in a wall of a melt-containing vessel, the probe having a pressure-deflectable end portion for contact with pressurized melt, pressure-resistant securing means associated with said device for fixing the device in the wall with said end portion of the probe exposed for contact with the melt in a non-flow obstructive relationship, and a seal surface on said probe between said end portion of the probe and the securing means, for cooperative sealing action with a mating sealing means associated with the wall to prevent exposure of said melt to said securing means, and pressure detection means internal of the probe, responsive to deflection of the end portion of the probe, for detecting pressure of said melt, said pressure detection means comprising a temperature-compensated capacitive sensor having, effectively, a capacitor, one plate of the capacitor defined by the end portion of the probe exposed to the melt, the opposite plate of said capacitor mounted within the probe in spaced relation to said end portion, a capacitive gap being defined by said end portion and said opposite plate, and electronic circuitry remote from the melt-exposed end portion of the probe and connected to said capacitor in a manner to compensate for change of temperature effects on the capacitor and to generate an output signal proportional to said melt pressure, said electronic circuitry comprising circuitry means mounted within a portion of the probe to generate a signal proportional to the capacitance of said capacitive sensor and wherein said pressure-deflectable end portion of said probe at a center region has a connection member, a peripheral outer region of said end portion of the probe being substantially undeflected by said melt pressure, and thereby substantially fixed from translating as compared to the center region of said end portion of the probe, which translates axially in response to said melt pressure, said outer region of the end portion of the probe forming said one plate of said capacitor, and said opposite plate of said capacitor comprises a rigid disk having a first face joined at its center to said connection member, a conducting region on said first face, located radially outward of said connection member, forming said capacitor with said outer region of the end portion of the probe.

2. The device of claim 1 wherein said circuitry means mounted within a portion of the probe is at least six inches from the melt-exposed end of the probe.

3. The device of claim 2 wherein said electronic circuitry is entirely located within a portion of said probe remote from the melt-exposed end of the probe.

4. The device of claim 1 wherein said connection member is integral with said end portion of said probe.

5. The device of claim 4 wherein the overall end of said probe is of a circular geometry having a diameter not exceeding 0.40 inches.

6. The device of claim 1 wherein said rigid disk comprises a disk of ceramic material.

7. The device of claim 1 wherein said rigid disk comprises an insulating material and said conducting region on said disk is defined by a layer of conducting material deposited on said first face of said disk.

8. The device of claim 7 wherein said end portion of said probe comprises nickel alloy and said disk comprises a ceramic insulator.

9. The device of claim 1 wherein the end portion of said probe is contoured such that the thickness of said end portion decreases from the periphery of said end portion radially inward to a point of minimum thickness and increases from said point to said center region.

10. The device of claim 1 wherein the materials of said probe and said opposite capacitor plate are chosen such that said capacitive sensor is operative for melt temperatures ranging between 70°

F. and 1000°

F.

11. The invention of claim 1 further comprising a melt processing machine associated with means to provide heated, pressurized melt within the machine, said melt useful in cooled state for forming solid objects, the machine including a wall for confining said pressurized melt having an aperture in which said probe is inserted.

12. A pressure measurement device comprising a probe having a pressure-deflectable end surface and pressure detection means internal of the probe, responsive to deflection of the end surface of the probe, for detecting pressure, said pressure detection means comprising a capacitive sensor having, effectively, a capacitor, one plate of the capacitor defined by the end surface of the probe, the opposite plate of said capacitor mounted within the probe in spaced relation to said end surface, a capacitive gap being defined by said end surface and said opposite plate, means for detecting the temperature of said end surface, and electronic circuitry remote from said end surface and connected to said capacitor in a manner to generate an output signal that is linearly proportional to pressure, said circuitry including means for storing a plurality of pressure versus capacitance and temperature data that is characteristic of the device, means for generating a first signal based on the capacitance of said capacitive sensor, means for generating a second signal based on the temperature of said end surface, and means for generating said output signal using said first and second signals with a predetermined functional relationship between capacitance, temperature, and pressure, wherein said electronic circuitry further comprises means for generating a linearization signal based on said first and second signals, said linearization signal indicating the difference between said first signal, as it relates to the measured capacitance of said capacitive sensor, and the desired linearized output signal, and means for adding said linearization signal to said first signal to produce said output signal, whereby said output signal is linearly proportional to the melt pressure.

13. The device of claim 12 wherein said electronic circuitry further comprises means for generating a second output signal proportional to the melt temperature.