Tough, processable simultaneous semi-interpenetrating polyimides

• US 5,492,979 A
• Filed: 04/04/1994
• Issued: 02/20/1996
• Est. Priority Date: 11/02/1989
• Status: Expired due to Fees

• Current Assignee: United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration
• Original Assignee: United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration
• Inventors: Pater, Ruth H.
• Primary Examiner(s): WOODWARD, ANA LUCRECIA
• Application Number:
  US08/222,761
• Time in Patent Office: 687 Days
• Field of Search: 525/421, 525/436, 525/432
• US Class Current: 525/421
• CPC Class Codes: C08G 73/101 containing chain terminating or branching agents
• CPC Class Codes: C08G 73/1039 comprising halogen-containing substituents
• CPC Class Codes: C08G 73/1067 Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
• CPC Class Codes: Y10S 525/903 Interpenetrating network

Abstract

A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid® materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.

Claims

1. A tough, processable semi-interpenetrating polymer network prepared by reacting an uncrosslinked, acetylene-terminated thermosetting polyimide prepolymer with a mixture of monomer precursors of a linear thermoplastic polyimide.

2. A tough, processable semi-interpenetrating network according to claim 1, wherein the mixture of monomer precursors of a linear thermoplastic polyimide comprises the following three compounds:

##STR5##

3. A tough, processable semi-interpenetrating polymer network according to claim 2, wherein compound (a)is present in a stoichiometric quantity with respect to the total of compound (b) and compound (c), and the molar ratio of compound (b):

compound (c)is about 95;

5.

4. A tough, processable semi-interpenetrating polymer network according to claim 1, wherein the uncrosslinked, acetylene-terminated thermosetting polyimide prepolymer is prepared from the following amic acid:

##STR6##

5. A tough, processable semi-interpenetrating polymer network according to claim 1, wherein the uncrosslinked, acetylene-terminated thermosetting polyimide prepolymer is:

##STR7##

6. A tough, processable semi-interpenetrating polymer network according to claim 1, wherein the uncrosslinked, acetylene-terminated thermosetting polyimide prepolymer is:

##STR8##

7. A tough, processable semi-interpenetrating polymer network according to claim 1, wherein the uncrosslinked, acetylene-terminated thermosetting polyimide prepolymer is:

##STR9## wherein n=1 to 30.

8. A tough, processable semi-interpenetrating polymer network according to claim 1, wherein the uncrosslinked, acetylene-terminated thermosetting polyimide prepolymer and the monomer precursors of the linear thermoplastic polyimide are present in a weight ratio from about 80:

20 to about 20;

80.

9. An adhesive prepared from the semi-interpenetrating polymer network of claim 1.

10. A polymer matrix composite prepared from the semi-interpenetrating polymer network of claim 1.

11. A molding compound prepared from the semi-interpenetrating polymer network of claim 1.