Small manufacturable array lattice layers

• US 5,493,305 A
• Filed: 04/15/1993
• Issued: 02/20/1996
• Est. Priority Date: 04/15/1993
• Status: Expired due to Term

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Smalanskas, Joseph P., Wooldridge, John J., Newberg, Irwin L., Wolfson, Ronald I.
• Primary Examiner(s): Issing, Gregory C.
• Application Number:
  US08/048,635
• Time in Patent Office: 1,041 Days
• Field of Search: 342/157, 342/158, 342/371, 342/372, 342/368, 343/700 MS
• US Class Current: 342/368
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00

Abstract

An electronic device operating in the microwave frequency range having components disposed in a plurality of planes, wherein the planes are stacked vertically. The electronic device is a T/R module or element forming a part of a subarray used in an active array radar. The T/R module or element comprises a transmit chip, a receive chip, low noise amplifiers, a phase shifter, an attenuator, switches, dc power supply, interconnects that interconnect the foregoing components and logic circuits to control the foregoing components. The components when stacked in a 3-D package are disposed behind a radiator or antenna, which transmits and receives the microwave signals. Behind the T/R module or element is a manifold which provides input and output to and from the T/R module or element. The microwave chips of the T/R module are monolithic microwave integrated circuit chips and control logic, which are disposed in an aluminum nitride substrate and coated with a conformal hermetic coating. The 3-D chip package can optionally include micro channel cooling by adding additional layers. The integrated circuits also employ a flip chip design for mounting to the wafers. Optional photonic interconnects could be used for communication between levels in the 3-D package and can be used between subarrays as a manifold.

Claims

1. A subarray in an active array used for transmission and reception of a microwave RF signal, said microwave signal being generated in an exciter, said subarray comprising:

a manifold to convey the microwave signal from the exciter;

beam steering means, for steering the microwave signal received from the manifold;

a transmit amplifier connected to the beam steering means, for amplifying the microwave signal prior to transmission;

an antenna connected to the transmit amplifier, for propagating the microwave signal toward a target and for receiving a reflected microwave signal reflected from the target; and

a receive amplifier, for amplifying the reflected microwave signal from the antenna;

wherein the receive amplifier directs the reflected microwave signal to the beam steering means, which then transmits the reflected microwave signal to the manifold, which then transmits the reflected microwave signal to a receiving means, for interpreting and outputting the reflected microwave signal; and

wherein discrete, active high-frequency RF components including the transmit amplifier, the receive amplifier, and the beam steering means are disposed on a plurality of planes aligned in a column so that the reflected microwave signal is transmitted vertically among the discrete, active high-frequency RF components disposed on the plurality of planes.

2. The subarray, according to claim 1, wherein the subarray further comprises a switch for alternately activating the transmit amplifier and the receive amplifier.

3. The subarray, according to claim 2, wherein the steering means further comprises a phase shifter.

4. The subarray, according to claim 3, wherein the subarray further comprises a controller, disposed on one of the plurality of planes, for controlling the subarray.

5. The subarray, according to claim 4, wherein the receiving means further comprises a summer for summing the reflected microwave signal, a receiver, and a signal processor to interpret the reflected microwave signals, wherein the summer, the receiver, and the signal processor are disposed on the plurality of planes.

6. The subarray, according to claim 5, wherein the transmit amplifier comprises a high power transmit amplifier.

7. The subarray, according to claim 6, wherein the receive amplifier comprises a low noise amplifier.

8. The subarray of claim 7, wherein the subarray further comprises photonic interconnects, interconnecting at least two of the plurality of planes.

9. The subarray of claim 8, wherein at least one of the plurality of planes comprises an aluminum nitride ceramic wafer.

10. A subarray in an active array used for transmission and reception of a microwave signal, said subarray comprising:

antenna means for transmitting and receiving said microwave signal;

means for amplifying said microwave signal from said antenna means;

means for phase shifting said microwave signal from said means for amplifying;

means for attenuating said microwave signal from said means for shifting;

means for switching said antenna means and means for amplifying, phase shifting, and attenuating;

means for controlling said antenna means and means for amplifying, phase shifting, attenuating and switching; and

wherein discrete, active high-frequency RF components including said means for amplifying, phase shifting, attenuating, and switching are disposed on a plurality of planes stacked vertically and said microwave signal is transmitted vertically between said discrete, active high-frequency RF components disposed on said stacked planes.

11. A subarray, according to claim 10, wherein at least one interconnection among the antenna means, means for amplifying, means phase shifting means for attenuating, means for switching, and means for controlling is a photonic interconnection.

12. A subarray, according to claim 11, wherein at least one of said antenna means and means for amplifying, phase shifting, attenuating, switching and controlling includes a monolithic microwave integrated circuit flip chip.

13. A subarray, according to claim 12, wherein at least one of said planes is an aluminum nitride wafer.

14. A subarray, according to claim 13, wherein said monolithic microwave integrated circuit flip chip is coated with a conformal hermetic coating.

15. A subarray, according to claim 14, wherein said planes further include microchannels for cooling.

16. A method for building a subarray in an active array used for transmission and reception of a microwave signal, said method comprising the steps of:

providing an antenna for interfacing said microwave signal;

providing a means for amplifying said microwave signal from said antenna;

providing a means for phase shifting said microwave signal from said means for amplifying;

providing a means for controlling said means for amplifying and phase shifting;

disposing discrete, active high-frequency RF components including said antenna and said means for amplifying, phase shifting and controlling on a plurality of planes; and

stacking said plurality of planes in an overlying relationship such that said microwave signal is transmitted vertically among said discrete, active high-frequency RF components disposed on said planes.

17. An electronic component for processing a microwave signal, comprising:

an antenna for interfacing said microwave signal;

means for amplifying said microwave signal from said antenna;

means for phase shifting said microwave signal from said means for amplifying; and

means for controlling said microwave signal from said means for phase shifting;

wherein discrete, active high-frequency RF components including said means for amplifying, and phase shifting are disposed on a plurality of planes stacked in an overlying relationship and said microwave signal is transmitted vertically between said discrete, active high-frequency RF components disposed on said planes.