Face-mounting type module substrate attached to base substrate face to face

• US 5,495,395 A
• Filed: 09/24/1992
• Issued: 02/27/1996
• Est. Priority Date: 09/30/1991
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Yoneda, Takehiko, Tsujhi, Tetsjhi, Taki, Hiromitsu, Takayama, Yoshihiko, Yoshimoto, Masahiro
• Primary Examiner(s): SPARKS, DONALD ALAN
• Application Number:
  US07/949,977
• Time in Patent Office: 1,251 Days
• Field of Search: 174/265, 174/138 G, 174/151, 174/152 R, 174/153 G, 228/180.21, 228/180.22, 361/760, 361/762, 361/769, 361/770, 361/771, 361/773, 361/776, 361/784, 361/785, 361/787, 361/789, 361/790, 361/807, 361/808, 361/809, 361/735, 361/736, 361/742, 361/743 , 361/744, 361/767, 361/774, 439/79, 439/80, 439/75, 439/81, 439/82, 439/84, 439/85, 439/87, 439/90, 439/91, 439/591, 439/586
• US Class Current: 361/765
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

Claims

1. A face-mounting type module substrate, comprising:

a module substrate mounting first electronic parts on a front surface thereof;

a through hole penetrating the module substrate from the front surface to its reverse surface;

a conductive film placed in the through hole for electrically conducting the first electronic parts of the module substrate to the reverse surface of the module substrate;

attaching means made of a thin film having conductivity for attaching the conductive film to a base substrate movably contacting the reverse surface of the module substrate to electrically connect the first electronic parts of the module substrate with second electronic parts of the base substrate, the module substrate being directly mounted on the base substrate face to face; and

a bushing held in the through hole for holding the conductive film to maintain the attachment of the conductive film to the base substrate regardless of whether the base substrate is moved, the bushing being made of resin with plasticity, and the conductive film being coated on a surface of the bushing.

2. A face-mounting type module substrate according to claim 1 in which the bushing is cylinder-shaped.

3. A face-mounting type module substrate according to claim 1 in which the conductive film coated on the surface of the bushing is made of a conductive material selected from the group of copper, gold and silver.

4. A face-mounting type module substrate according to claim 1 in which the module substrate is made of dielectric ceramic material selected from the group consisting of Al₂ O₃, Ba₂ Ti₉ O₂₀, aluminum enamel, and quartz polyimide.

5. A face-mounting type module substrate according to claim 1 in which the resin of the bushing is selected from the group consisting of fluorocarbon resin, polyimide, and liquid crystal polymer.

6. A face-mounting type module substrate according to claim 1 in which the attaching means is a conductive solder.

7. A face-mounting type module substrate according to claim 1 in which the conductive film is composed of a mediate film coated on the surface of the bushing and a conductive film coated on the mediate film, a material of the mediate film being selected from the group of chromium and nickel, and a material of the conductive film being selected from the group of copper, gold and silver.

8. A face-mounting type module substrate according to claim 1 wherein the bushing has a property of plastic deformation so that a stress occurring through the attaching means between the module substrate and the base substrate resulting from the cooling down of the module substrate and the base substrate subsequent to both substrates having been heated to attach to each other is absorbed and released by the bushing.

9. A face-mounting type module substrate, comprising:

a module substrate having mounted on a front surface thereof first electronic parts;

a through hole penetrating the module substrate from the front surface to its reverse surface;

a conductive film placed in the through hole for electrically conducting the first electronic parts of the module substrate to the reverse surface of the module substrate;

attaching means made of a thin film having conductivity for attaching the conductive film to a base substrate movably contacting with the reverse surface of the module substrate to electrically connect the first electronic parts of the module substrate with second electronic parts of the base substrate, the module substrate being directly mounted on the base substrate face to face, and the module substrate being attached to the base substrate through the attaching means by hardening the heated thin film; and

a bushing held in the through hole for holding the conductive film, the bushing being made of resin with plasticity so as to be plastically deformable for absorbing a stress occurring between the module substrate and the base substrate.

10. A face-mounting type module substrate according to claim 9 in which the stress occurring between the module substrate and the base substrate is caused by the module substrate and the base substrate being cooled down subsequent to both substrates having been heated to attach to each other through the attaching means.