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Method for forming contact pins for semiconductor dice and interconnects

  • US 5,495,667 A
  • Filed: 11/07/1994
  • Issued: 03/05/1996
  • Est. Priority Date: 11/07/1994
  • Status: Expired due to Term
First Claim
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1. A method for forming a contact structure on an interconnect, said contact structure adapted to establish an electrical connection with a contact location on a semiconductor die, said method comprising:

  • providing a substrate;

    attaching a wire to the substrate using a method selected from the group consisting of wire bonding and welding;

    heating and shaping the wire into a compliant structure during said attaching step; and

    severing the wire to form a contact pin.

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