Hot press for use in production of multilayered substrate

• US 5,496,433 A
• Filed: 03/29/1993
• Issued: 03/05/1996
• Est. Priority Date: 03/27/1992
• Status: Expired due to Fees

• Current Assignee: Hitachi Techno Engineering Company Limited (Hitachi, Ltd.)
• Original Assignee: Hitachi Techno Engineering Company Limited (Hitachi, Ltd.)
• Inventors: Miyashita, Akimi, Fujii, Mutsumasa, Kogawa, Kiyonori, Kyoui, Masayuki
• Primary Examiner(s): Drodge, Joseph W.
• Application Number:
  US08/038,293
• Time in Patent Office: 1,072 Days
• Field of Search: 156/358, 156/583.1, 156/498, 156/583.91, 156/285, 156/286, 156/382, 100/48, 100/50, 100/93 P, 100/99, 425/407, 425/405.1
• US Class Current: 156/358
• CPC Class Codes: B29C 2037/903 by means of a computer
• CPC Class Codes: B29C 2043/561 under vacuum conditions
• CPC Class Codes: B29C 2043/5808 pressure or compressing force
• CPC Class Codes: B29C 33/20 Opening, closing or clamping
• CPC Class Codes: B29C 43/203 Making multilayered articles
• CPC Class Codes: B29C 43/32 Component parts, details or accessories; Auxiliary operations
• CPC Class Codes: B29C 43/56 Compression moulding under special conditions, e.g. vacuum
• CPC Class Codes: B29C 43/58 Measuring, controlling or regulating for bank adjustment in calendering B29C43/245
• CPC Class Codes: B30B 15/064 with heating or cooling means
• CPC Class Codes: B32B 2309/12 Pressure
• CPC Class Codes: B32B 2309/72 For measuring or regulating, e.g. systems with feedback loops
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

A hot press for producing a multilayered substrate including vertically opposing upper and lower bolsters relatively movable toward each other to press multilayered substrate blanks and to cool the plates after the bonding. A sealing arrangement includes a cylinder and encloses the upper and lower bolsters so as to define a hermetically sealed space, with an evacuating arrangement reducing the pressure inside the hermetically sealed space during heating and pressing in which a bonding agent in the multilayered substrate blanks is softened. A high-pressure gas supplying arrangement supplies a pressurizing gas into the hermetically sealed space so as to impart the bonding pressure. A pressure sensor detects the pressure inside the hermetically sealed space, and a controller effects a compensation for incremental increases in the bonding pressure when the pressure inside the hermetically sealed space is reduced by the evacuating arrangement and for incrementally decreasing the bonding pressure when the pressure inside the space is elevated by the pressurized gas, by feedback output signals of the pressure sensor to the hydraulic pressure source.

Claims

1. A hot press for producing a multilayered substrate, comprising:

upper and lower bolsters which are arranged to vertically oppose each other and to be movable relative to and toward each other to press multilayered substrate blanks therebetween;

a main ram for imparting relative movement between said upper and lower bolsters to produce a pressing force;

upper and lower heat plates which are provided on said upper and lower bolsters through heat insulating plates respectively;

heating and cooling means for heating said upper and lower heat plates during bonding of said multilayered substrate blanks and for cooling said plates after the bonding;

sealing means including a cylindrical member and defining a hermetically sealed space of variable volume in cooperation with said upper and lower bolsters;

evacuating means for evacuating said hermetically sealed space to reduce the pressure therein during a heating and pressing operation, performed by said heating and cooling means and by said main ram, for softening a bonding agent for said multilayered substrate blanks;

gas supplying means for supplying gas into said hermetically sealed space to elevate the pressure in said space, thereby imparting a bonding pressure to said multilayered substrate blanks during the bonding;

pressure sensing means for sensing the pressure inside said hermetically sealed space; and

control means for effecting pressure compensation by controlling pressure of a hydraulic pressure source to be supplied to said main ram in accordance with outputs from said pressure sensing means so as to cancel an increment in the bonding pressure on said blanks, when the pressure in said hermetically sealed space is reduced by said evacuating means, and to cancel a decrement in the bonding pressure on said blanks when the pressure in said space is elevated by said gas supplying means.

2. A hot press according to claim 1, wherein said control means includes a computer means which computes said increment in the bonding pressure as a product (P₁×

π

D² /4) of the pressure P₁ inside said hermetically sealed space and an area π

D² /4 determined by the inside diameter D of said cylindrical member defining said hermetically sealed space, and also computes said decrement in the bonding pressure as a product of the pressure P₂ inside said hermetically sealed space and a value (π

D² /4-L₁ ×

L₂) obtained by subtracting the area (L₁ ×

L₂ ) of the multilayered substrate from the area π

D² /4 determined by said cylindrical member inside diameter D. pressure over said multilayered substrate blanks attributable to a warp of each bolster during the bonding.

3. A hot press according to claim 1, further comprising an one intermediate heat plate disposed between said upper and lower heat plates and lifting means for lifting and lowering said intermediate heat plate.

5. A hot press according to claim 3, further including an intermediate heat plate disposed between said upper and lower heat plates and lifting means for lifting and lowering said intermediate heat plate.

4. A hot press for producing a multilayered substrate, comprising:

upper and lower bolsters arranged to vertically oppose each other and to be movable relative to and toward each other to press multilayered substrate blanks therebetween;

a main ram for imparting relative movement between said upper and lower bolsters to produce a pressing force;

upper and lower heat plates provided on said upper and lower bolsters through heat insulating plates, respectively;

heating and cooling means for heating said upper and lower heat plates during bonding of said multilayered substrate blanks and for cooling said plates after bonding;

sealing means including a cylinder and defining a hermetically sealed space in cooperation with said upper and lower bolsters;

evacuating means for evacuating said hermetically sealed space to reduce the pressure therein during a heating and pressing operation, performed by said heating and cooling means and by said main ram, for softening a bonding agent for said multilayered substrate blanks;

gas supplying means for supplying gas into said hermetically sealed space to elevate the pressure in said space, thereby imparting a bonding pressure to said multilayered substrate blanks during the bonding;

pressure sensing means for sensing the pressure inside said hermetically sealed space;

control means for effecting pressure compensation by controlling pressure of a hydraulic pressure source to be supplied to said main ram in accordance with outputs from said pressure sensing means so as to cancel an increment in the bonding pressure on said multilayered substrate blanks when the pressure in said hermetically sealed space is reduced by said evacuating means, and to cancel a decrement in the bonding pressure on said multilayered substrate blanks when the pressure in said hermetically sealed space is elevated by said gas supplying means; and

an auxiliary ram provided on at least one of said upper and lower bolsters and capable of effecting compensation for non-uniform distribution of the bonding pressure to said multilayered substrate blanks attributable to warpage of at least one of said bolsters during the bonding.