Embedded substrate for integrated circuit modules

• US 5,497,033 A
• Filed: 06/20/1994
• Issued: 03/05/1996
• Est. Priority Date: 02/08/1993
• Status: Expired due to Term

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Martin Marietta Corporation
• Inventors: Wildi, Eric J., Daum, Wolfgang, Fillion, Raymond A., Woinarowski, Robert J., Gdula, Michael, Cole, Herbert S.
• Primary Examiner(s): Limanek, Robert P.
• Assistant Examiner(s): Hardy, David B.
• Application Number:
  US08/262,181
• Time in Patent Office: 624 Days
• Field of Search: 257/700, 257/792, 257/793, 257/795, 257/723, 257/724, 361/761, 361/762, 361/713, 361/790, 361/771, 361/729, 361/783
• US Class Current: 257/723
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/2518 being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/83005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/92144 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06524 Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 2225/1035 : the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1064 : Electrical connections provided on a side surface of one or more of the containers
• CPC Class Codes: H01L 23/293 : Organic, e.g. plastic
• CPC Class Codes: H01L 23/295 : containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/4334 : Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/538 : the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.

Claims

1. An integrated circuit module, comprising:

a plurality of chips, each of said chips having contact pads disposed thereon, all of said pads located on a common plane;

hardened substrate molding material surrounding said chips, except for the faces of said chips, said substrate material comprising a blend of polyimide, epoxy, and crosslinking catalyst, and said substrate material including a filler material comprising a selected one of the group consisting of glass, alumina, aluminum nitride, aluminum silicon carbide, aluminum and diamond, graphite;

a thermal plug extending from the backside of at least one of said plurality of chips at least through to the opposite side of said hardened substrate molding material; and

HDI means, formed over said chip top surfaces, for electrically interconnecting predetermined ones of said contact pads.

2. The module of claim 1, wherein said thermal plug comprises an electrically conductive material.

3. The module of claim 1, wherein said thermal plug comprises a material selected from the group consisting of copper, molybdenum, and a silicon carbide matrix infiltrated with aluminum.

4. An integrated circuit module, comprising:

a plurality of chips, each of said chips having contact pads disposed thereon, all of said pads located on a common plane;

hardened substrate molding material surrounding said chips, except for the faces of said chips, said substrate material comprising a selected one of the group consisting of thermoplastics, thermosets, polyetherimide resins, polytetrafluoroethylenes, epoxies, benzocyclobutene, acrylates, polyurethanes, and polyimides, said substrate material including a filler material comprising a selected one of the group consisting of glass, SiC, Al₂ O₃, AlN, diamond, graphite, and metal;

an inner dielectric layer positioned between said chips and said hardened substrate molding material;

an electrically conductive strip extending along said inner dielectric layer from a backside of at least one of said chips to said dielectric layer, and

HDI means, formed over said chip faces, for electrically interconnecting predetermined ones of said contact pads.

5. The module of claim 4, further including an electrical connection from said electrically conductive strip to one potential selected from the group consisting of a voltage source and ground.

6. An integrated circuit module, comprising:

a plurality of chips, each of said chips having contact pads disposed thereon, all of said pads located on a common plane;

hardened substrate molding material surrounding said chips, except for the faces of said chips, said substrate material comprising a selected one of the group consisting of thermoplastics, thermosets, polyetherimide resins, polytetrafluoroethylenes, epoxies, benzocyclobutene, acrylates, polyurethanes, and polyimides, said substrate material including a filler material comprising a selected one of the group consisting of glass, SiC, Al₂ O₃, AlN, diamond, graphite, and metal;

a thermal plug extending from the backside of at least one of said plurality of chips through said hardened plastic substrate to a surface of said substrate; and

HDI means, formed over said chip faces, for electrically interconnecting predetermined ones of said contact pads.