Semiconductor electrical heater and method for making same
First Claim
1. A method of establishing an ohmic mechanical joint between a metallic element and a semiconductor element comprising the steps of:
- superposing at least a portion of a metallic element with at least a portion of a semiconductor element;
directing a controlled amount of heat at said superposed portion of said semiconductor element through a hole in said superposed portion of said metallic element so as to cause an amount of semiconductor material to melt and flow into the hole and react with metallic material of said metallic element to form reacted materials, said melting, flowing and reacting steps including the step of at least partially filling said hole with said reacted materials; and
allowing the reacted materials to solidify in the hole to provide a joint having a substantially ohmic electrical resistance between the metallic element and the semiconductor element.
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Accused Products
Abstract
A method is disclosed for mechanically and electrically bonding metallic materials and semiconductor materials. The method according to the invention may be used, for example, in forming a semiconductor electrical heater, particularly for use in electrical smoking articles. A metallic element, such as a copper alloy power supply tab, is laser welded to a semiconductor element, such as a doped silicon resistive heater element. A laser beam is directed through a hole in the copper alloy tab to melt some silicon material, which flows into the hole in the copper tab, reacts and intermixes with the copper and solidifies to form a slug containing copper silicide. A protective material such as nickel may be applied to protect the copper silicide from oxidation if desired. An ohmic, low resistance contact and high strength bond is provided between the parts.
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Citations
51 Claims
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1. A method of establishing an ohmic mechanical joint between a metallic element and a semiconductor element comprising the steps of:
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superposing at least a portion of a metallic element with at least a portion of a semiconductor element; directing a controlled amount of heat at said superposed portion of said semiconductor element through a hole in said superposed portion of said metallic element so as to cause an amount of semiconductor material to melt and flow into the hole and react with metallic material of said metallic element to form reacted materials, said melting, flowing and reacting steps including the step of at least partially filling said hole with said reacted materials; and allowing the reacted materials to solidify in the hole to provide a joint having a substantially ohmic electrical resistance between the metallic element and the semiconductor element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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Specification