Method of fabricating optical component including first and second optical waveguide chips having opposed inclined surfaces

• US 5,499,309 A
• Filed: 09/30/1994
• Issued: 03/12/1996
• Est. Priority Date: 10/01/1993
• Status: Expired due to Fees

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Osugi, Yukihisa, Fukuyama, Masashi, Kozuka, Yoshinari
• Primary Examiner(s): Lee, John D.
• Application Number:
  US08/314,302
• Time in Patent Office: 529 Days
• Field of Search: 385/15-18, 385/31, 385/38, 385/39, 385/44, 385/45, 385/47-52, 385/65, 385/83, 385/147
• US Class Current: 385/38
• CPC Class Codes: G02B 6/2817 using reflective elements to split or combine optical signals
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures

Abstract

A V groove and guide grooves are defined in a ceramic substrate, and an optical fiber is fixedly disposed in the V groove by the ceramic substrate and a cover, thereby producing a first optical waveguide chip. A V groove and guide grooves are also defined in another ceramic substrate, and an optical fiber is fixedly disposed in the V groove by the ceramic substrate and a cover, thereby producing a second optical waveguide chip. The first optical waveguide chip has an end face inclined to the direction of propagation of light through the optical fiber thereof, and the second optical waveguide chip also has an end face inclined to the direction of propagation of light through the optical fiber thereof. The first and second optical waveguide chips are positioned relatively to each other by guide pins intimately placed in the guide grooves, and the inclined end faces extend substantially parallel to each other with an air layer interposed therebetween. An optical component such as an optical transmission/reception module thus produced can easily be reduced in size and cost, and fabricated in an integrated configuration.

Claims

1. A method of fabricating an optical component, comprising the steps of:

forming a first optical waveguide chip having a first optical waveguide;

forming a second optical waveguide chip having a second optical waveguide and different from said first optical waveguide chip;

processing said first optical waveguide chip to form a first end face thereof at which an end of said first optical waveguide is exposed;

polishing said first optical waveguide chip to an optical finish to incline a second end face thereof at which an opposite end of said first optical waveguide is exposed, to a direction in which light is propagated through said first optical waveguide;

processing said second optical waveguide chip to form a third end face thereof at which an end of said second optical waveguide is exposed;

polishing said second optical waveguide chip to an optical finish to incline a fourth end face thereof at which an opposite end of said second optical waveguide is exposed, to a direction in which light is propagated through said second optical waveguide; and

positioning said first optical waveguide chip and said second optical waveguide chip relative to each other such that said second and fourth end faces extend substantially parallel to each other with a layer interposed therebetween which has a refractive index that is different from the refractive index of at least one of said first and second optical waveguides, said first and second optical waveguides being optically coupled to each other such that a portion of light propagated from said first optical waveguide to said second optical waveguide is reflected out of at least one of the first and second optical waveguide chips by at least one of said second end face of said first optical waveguide chip and said fourth end face of said second optical waveguide chip, the reflected light propagating through a light transmissive portion of at least one of said optical waveguide chips.

2. A method according to claim 1, wherein at least one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover.

3. A method according to claim 1, wherein both the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprise the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover.

4. A method according to claim 1, wherein at least one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate.

5. A method according to claim 1, wherein both the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprise the step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate.

6. A method according to claim 5, wherein said step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate comprises the step of diffusing an impurity into a dielectric substrate made of LiNbO₃, LiTaO₃, glass, or a semiconductor to form the optical waveguide in said dielectric substrate.

7. A method according to claim 1, wherein said layer comprises one of a layer of air, a layer of dielectric, or a layer of metal.

8. A method according to claim 1, wherein said layer comprises one of a layer of dielectric or a layer of metal, and the ends of said first and second optical waveguides which are exposed at said second and fourth end faces are held in direct contact with opposite surfaces, respectively, of said layer and are optically coupled to each other.

9. A method according to claim 1, wherein one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover, and wherein the other of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate.

10. A method according to claim 1, wherein said step of positioning comprises the steps of defining first and second guide grooves in said first and second optical waveguide chips and positioning said first and second optical waveguide chips with reference to pins intimately held in said first and second guide grooves.

11. A method according to claim 1, wherein both of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprise the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover, and wherein said step of positioning comprises the steps of defining first and second guide grooves in said first and second optical waveguide chips and positioning said first and second optical waveguide chips with reference to pins intimately held in said first and second guide grooves.

12. A method according to claim 1, wherein at least one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover made of a material which passes light propagated through said optical fiber, said method further comprising the step of fixing to said cover a light-detecting element for detecting the light which is reflected out of at least one of the first and second optical waveguide chips by at least one of said second end face and said fourth end face.

13. A method according to claim 1, further comprising the step of providing a light source for introducing light into said second optical waveguide.

14. A method according to claim 13, further comprising the step of providing an optical coupling means for optically coupling the light from said light source to the end of said second optical waveguide which is exposed at said third end face.

15. A method according to claim 1, wherein said step of forming a first optical waveguide chip having a first optical waveguide comprises the step of forming a first optical waveguide having a plurality of parallel optical waveguides, and said step of forming a second optical waveguide chip having a second optical waveguide comprises the step of forming a second optical waveguide having a plurality of parallel optical waveguides.

16. A method according to claims 1, further comprising the step of providing a light-detecting element for detecting the light which is reflected out of at least one of the first and second optical waveguide chips by at least one of said second end face and said fourth end face.

17. A method of fabricating an optical component, comprising the steps of:

forming a first optical waveguide chip having a first optical waveguide;

forming a second optical waveguide chip having a second optical waveguide which has a refractive index different from the refractive index of said first optical waveguide, and different from said first optical waveguide chip;

processing said first optical waveguide chip to form a first end face thereof at which an end of said first optical waveguide is exposed;

polishing said first optical waveguide chip to an optical finish to incline a second end face thereof at which an opposite end of said first optical waveguide is exposed, to a direction in which light is propagated through said first optical waveguide;

processing said second optical waveguide chip to form a third end face thereof at which an end of said second optical waveguide is exposed;

polishing said second optical waveguide chip to an optical finish to incline a fourth end face thereof at which an opposite end of said second optical waveguide is exposed, to a direction in which light is propagated through said second optical waveguide; and

positioning said first optical waveguide chip and said second optical waveguide chip relative to each other such that said second and fourth end faces extend substantially parallel to each other, the ends of said first and second optical waveguides which are exposed at said second and fourth end faces being held in direct contact with each other and being optically coupled to each other such that a portion of light propagated from said first optical waveguide to said second optical waveguide is reflected out of at least one of the first and second optical waveguide chips by at least one of said second end face of said first optical waveguide chip and said fourth end face of said second optical waveguide chip, the reflected light propagating through a light transmissive portion of at least one of said optical waveguide chips.

18. A method according to claim 17, wherein at least one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover.

19. A method according to claim 17, wherein both of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprise the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover.

20. A method according to claim 17, wherein at least one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate.

21. A method according to claim 20, wherein said step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate comprises the step of diffusing an impurity into a dielectric substrate made of LiNbO₃, LiTaO₃, glass, or a semiconductor to form the optical waveguide in said dielectric substrate.

22. A method according to claim 17, wherein both of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprise the step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate.

23. A method according to claim 17, wherein one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover, and wherein-the other of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the step of diffusing an impurity in a dielectric substrate to form the optical waveguide in said dielectric substrate.

24. A method according to claim 17, wherein said step of positioning comprises the steps of defining first and second guide grooves in said first and second optical waveguide chips and positioning said first and second optical waveguide chips with reference to pins intimately held in said first and second guide grooves.

25. A method according to claim 17, wherein at least one of the step of forming a first optical waveguide chip having a first optical waveguide and the step of forming a second optical waveguide chip having a second optical waveguide comprises the steps of placing an optical fiber in a V groove of a V-shaped cross section or a U groove of a U-shaped cross section which is defined in a substrate and fixing the optical fiber in the V or U groove with the substrate and a cover made of a material which passes light propagated through said optical fiber, said method further comprising the step of fixing to said cover a light-detecting element for detecting the light which is reflected out of at least one of the first and second optical waveguide chips by at least one of said second end face and said fourth end face.

26. A method according to claim 17, further comprising the step of providing a light source for introducing light into said second optical waveguide.

27. A method according to claim 26, further comprising the step of providing an optical coupling means for optically coupling the light from said light source to the end of said second optical waveguide which is exposed at said third end face.

28. A method according to claim 17, wherein said step of forming a first optical waveguide chip having a first optical waveguide comprises the step of forming a first optical waveguide having a plurality of parallel optical waveguides, and said step of forming a second optical waveguide chip having a second optical waveguide comprises the step of forming a second optical waveguide having a plurality of parallel optical waveguides.

29. A method according to claim 17, further comprising the step of providing a light-detecting element for detecting the light which is reflected out of at least one of the first and second optical waveguide chips by at least one of said second end face and said fourth end face.