Receptacle for connecting parallel fiber optic cables to a multichip module

• US 5,499,311 A
• Filed: 12/16/1994
• Issued: 03/12/1996
• Est. Priority Date: 12/16/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: DeCusatis, Casimer M.
• Primary Examiner(s): Lee, John D.
• Assistant Examiner(s): Palmer, Phan T. H.
• Application Number:
  US08/357,805
• Time in Patent Office: 452 Days
• Field of Search: 385/31, 385/14, 385/88-94, 385/76
• US Class Current: 385/89
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

A fiber optic receptacle for connecting standard fiber optic cable plug connectors with a multi-chip circuit module includes a surrounding non-insulative jacket having a thermal expansion joint. The jacket is preferably disposed in a recess along the edge of the multi-chip module substrate and is affixed thereto by means of solder ball technology so as to provide alignment and connection to grounding conductors. Internal fiber optic cables extend from the bottom of a recess in a receiving body which is surrounded by the non-insulative jacket. These internal optical fibers are coupled to fiber optic cables in an external plug connector with photonic receptors being present on selected circuit chips disposed on the multi-chip module structure. The connector structure solves problems of alignment, manufacturability, thermal expansion, bandwidth and compatibility in addition to problems associated with the dissipation of accumulated static charge.

Claims

1. A receptacle for a fiber optic cable connector having a plurality of optical fibers, said receptacle comprising:

a connector receiving body having a recess therein for receiving said fiber optic cable connector, said body also having at least one alignment means disposed within said recess;

a plurality of internal optical fibers disposed within said receiving body so as to extend from the bottom of said recess to provide external connectivity, said internal optical fibers being disposed so as to align with the optical fibers in said connector; and

a jacket disposed around at least a portion of said receiving body so as not to preclude access to said recess or to interfere with said plurality of internal optical fibers, said conductive jacket having a thermal expansion joint therein.

2. The receptacle of claim 1 in which said alignment means comprises at least one guide pin hole disposed at the bottom of said recess.

3. The receptacle of claim 1 in which said alignment means comprises at least one guide pin disposed at the bottom of said recess.

4. The receptacle of claim 1 in which said jacket possesses sufficient electrical conductivity to provide protection against electrostatic charge accumulation.

5. The receptacle of claim 1 in which there is further disposed a latching means in said recess to prevent inadvertent removal of said fiber optic connector from said recess.

6. The receptacle of claim 1 in which said expansion joint is of the ball-in-hole variety.

7. The receptacle of claim 1 further including ground contacting means affixed to the exterior of said jacket.

8. The receptacle of claim 7 in which said ground contacting means is a plurality of solder balls.

9. The receptacle of claim 1 further including means to prevent inverted insertion of said connector into said recess.

10. An electronic component assembly capable of exterior connection to a fiber optic cable connector, said electronic component assembly comprising:

an insulative substrate having at least one integrated circuit chip disposed thereon together with electrical conductors for the external electrical connection of said chip, said at least one chip having means disposed thereon for external optical communication;

a recess disposed at an edge of said substrate;

a jacket disposed within said recess in said substrate, said jacket having a thermal expansion joint therein;

a connector receiving body having a recess therein for receipt of said fiber optic cable connector, said connector receiving body being at least partially surrounded by said jacket; and

fiber optic cables extending from the bottom of said recess in said receiving body to at least one of said external optical communication means on at least one chip.

11. The component assembly of claim 10 further including alignment means disposed at the bottom of said recess.

12. The component assembly of claim 11 in which said alignment means comprises at least one guide pin hole disposed at the bottom of said recess.

13. The component assembly of claim 11 in which said alignment means comprises at least one guide hole disposed at the bottom of said recess.

14. The component assembly of claim 10 in which said jacket possesses sufficient electrical conductivity to provide protection against electrostatic charge accumulation.

15. The component assembly of claim 10 in which there is further disposed a latching means in said recess to prevent inadvertent removal of said fiber optic connector from said recess.

16. The component assembly of claim 10 in which said expansion joint is of the ball-in-hole variety.

17. The component assembly of claim 10 further including ground contacting means affixed to the exterior of said jacket.

18. The component assembly of claim 10 in which said ground contacting means is a plurality of solder balls.

19. The component assembly of claim 10 further including means to prevent inverted insertion of said connector into said recess.

20. The component assembly of claim 10 in which said jacket comprises a carbon filled plastic.