Double-sided oscillator package and method of coupling components thereto

• US 5,500,628 A
• Filed: 01/24/1995
• Issued: 03/19/1996
• Est. Priority Date: 01/24/1995
• Status: Expired due to Term

• Current Assignee: CTS Corporation
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Knecht, Thomas
• Primary Examiner(s): MIS, DAVID C
• Application Number:
  US08/378,135
• Time in Patent Office: 420 Days
• Field of Search: 331/67-70, 331/116 R, 331/116 FE, 331/158, 331/176, 310/311, 310/348, 361/752, 361/753, 361/757, 361/820, 361/728, 361/746, 361/747
• US Class Current: 331/68
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03B 5/32 being a piezoelectric resonator selection of piezoelectric material H10N30/00
• CPC Class Codes: H03H 9/08 Holders with means for regulating temperature

Abstract

A double-sided oscillator package (200) is provided. The package (200) has an open-top receptacle (212) adapted to receive an electronic component and an open-bottom receptacle (214) adapted to receive at least a piezoelectric element and a cover, forming a hermetic environment. The electronic component (226) and piezoelectric element (234), can be suitably connected to the package (200). The package (200) is designed to be mass-producable, and is compact, easily surface mounted and provides a narrow profile.

Claims

1. A double-sided temperature compensated oscillator package, comprising:

a platform including a central portion and an outer portion;

sidewalls extending substantially upwardly and substantially downwardly from the outer portion of the platform, the upwardly extending sidewalls terminate at a surface mountable end portion, the surface mountable end portion includes a plurality of contacts adapted to facilitate connection to an electrical device;

the upwardly extending sidewalls and the platform forming an open-top receptacle adapted to receive at least one electronic component and the downwardly extending sidewalls and the platform forming an open-bottom receptacle adapted to receive at least one piezoelectric component; and

a cover coupled with the open-bottom receptacle defining a hermetic environment.

2. The package of claim 1, wherein the open-top receptacle is adapted to receive a wire bonded integrated circuit.

3. The package of claim 1, wherein the open-top receptacle is substantially filled with a curable material and further contains a wire bonded integrated circuit therein.

4. The package of claim 1, wherein the open-bottom receptacle is adapted to receive a piezoelectric element and at least one capacitor.

5. The package of claim 4, wherein the open-bottom receptacle is adapted to receive at least two capacitors.

6. The package of claim 1, wherein the cover comprises a metal.

7. The package of claim 6, wherein the metallic cover includes at least two pockets on an inwardly facing surface, adapted to minimize the profile of the package.

8. The package of claim 7, wherein the at least two pockets are adapted and substantially in alignment with at least some of the components in the open-bottom receptacle.

9. The package of claim 1, wherein the bottom sidewalls include a ceramic portion and a metal portion.

10. The package of claim 9, wherein the metal portion includes an alloy of nickel, iron and cobalt.

11. A double-sided temperature compensated oscillator package, comprising:

a platform including a central portion and an outer portion;

sidewalls extending substantially upwardly and substantially downwardly from the outer portion of the platform;

the upwardly extending sidewalls and the platform forming an open-top receptacle and the downwardly extending sidewalls and the platform forming an open-bottom receptacle;

a cover couplable with the open-bottom receptacle defining a hermetic seal;

the open-top receptacle is adapted to receive at least one electronic component and is substantially filled with a curable material;

the open-bottom receptacle is adapted to receive a piezoelectric component; and

the upwardly extending sidewalls terminating in a plurality of contacts suitably connected by leads to the at least one electronic component and the piezoelectric component, whereby a surface mountable package is defined.

12. The package of claim 11, wherein the open-bottom receptacle is adapted to receive a piezoelectric element and at least one capacitor.

13. The package of claim 12, wherein the open-bottom receptacle is adapted to receive at least two capacitors.

14. The package of claim 11, wherein the cover comprises a metal.

15. The package of claim 14, wherein the metallic cover includes at least two pockets on an inwardly facing surface, adapted to minimize the profile of the package.

16. The package of claim 15, wherein the at least two pockets are adapted for and substantially in alignment with at least some of the components in the open-bottom receptacle.

17. A method of coupling components to a double-sided oscillator package, comprising:

a) providing a package having an open-bottom receptacle and an open-top receptacle;

b) mounting and hermetically sealing a piezoelectric element in the open-bottom receptacle; and

c) coupling electronic components in the open-top receptacle.

18. A method of coupling components to a double-sided oscillator package, comprising:

a) providing a ceramic package having an open-top receptacle and an open bottom receptacle;

b) mounting a piezoelectric element in the open-bottom receptacle;

c) frequency tuning the piezoelectric element;

d) hermetically sealing the piezoelectric element in the open-bottom receptacle; and

e) coupling electronic components to the open top receptacle.