Process for producing microstructure metallic elements

• US 5,501,784 A
• Filed: 03/10/1994
• Issued: 03/26/1996
• Est. Priority Date: 03/12/1993
• Status: Expired due to Fees

• Current Assignee: Microparts GmbH
• Original Assignee: Microparts GmbH
• Inventors: Lessmo/ llmann, Christoph, Reinecke, Holger, Eicher, Joachim
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): Leader, William T.
• Application Number:
  US08/208,296
• Time in Patent Office: 747 Days
• Field of Search: 205/67, 205/70, 205/72, 205/73, 205/75, 205/78, 205/79
• US Class Current: 205/67
• CPC Class Codes: B22F 3/1283 Container formed as an undeformable model eliminated after consolidation
• CPC Class Codes: B29C 33/42 characterised by the shape of the moulding surface, e.g. ribs or grooves
• CPC Class Codes: B29K 2883/00 Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
• CPC Class Codes: C23C 14/0005 Separation of the coating from the substrate
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/4807 Ceramic parts
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks

Abstract

A microstructured mold with at least one open cavity is produced from a solid body (metal, ceramic, glass, stone or monocrystalline material) by precision mechanical machining, additive or subtractive structuring. The cavity is filled and the mold covered by a flowable material and the solidified flowable material is separated from the mold giving a microstructure element. Alternatively, the top portion of the solidified flowable material is removed to expose the surface of the mold and the solidified material filling the cavity. A layer of conductive material is applied to the exposed surface and remaining solidified material. Then the conductive layer and the remaining solidified material are separated from the mold to provide a structure with a shape complementary to the mold. A layer of metal is electrodeposited on the complementary structure and, finally, the metal layer is separated to produce a metallic microstructure element. The microstructure elements produced by the process have good material properties and can be prepared in a broad range of shapes and structures.

Claims

1. A process for the production of a metallic element, comprising the steps of:

(a) forming a mold having an open cavity on one surface thereof from a solid body by mechanical machining, additive structuring or subtractive structuring,

(b) filling the cavity and covering the mold with a flowable electrically non-conductive material,

(c) solidifying the flowable electrically non-conductive material to form a solid layer in contact with the surface of said mold and filling said cavity,

(d) removing a portion of said solid layer to expose the surface of said mold and said cavity filled with solidified flowable material,

(e) applying a layer of conductive material to and covering the exposed surface of said mold and filled cavity,

(f) separating the conductive layer and solidified flowable material in the cavity from the mold to provide a structure having a shape complementary to the mold,

(g) electrodepositing a metal layer on the complementary structure, and

(h) separating the metal layer from the complementary structure to provide a metallic element.

2. The process of claim 1, wherein said flowable material is a reaction-curable resin and said solidifying occurs by curing said reaction-curable resin.

3. The process of claim 1, wherein said flowable material is a molten plastic and said solidifying occurs by cooling.

4. The process of claim 1, wherein said flowable material is pulverulent metal, ceramic or glass powder or a slip composition thereof and said solidifying occurs by drying, sintering or firing.

5. The process of claim 1, wherein said first separating step comprises physically lifting said solidified flowable material from said mold or comprises selective dissolution of said mold.

6. The process of claim 1, wherein said mold comprises metal, ceramic, glass or stone.

7. The process of claim 1, wherein said mold comprises silicon, quartz, gallium arsenide or germanium.

8. The process of claim 7, wherein said mold comprises monocrystalline silicon, quartz or germanium and said mold is formed by anisotropic etching or ion etching.

9. The process of claim 1, wherein said mold is prepared by additive structuring, wherein said additive structuring is physical or chemical vapor deposition onto said solid body.

10. The process of claim 1, wherein said process produces a metallic element having protrusions, cavities, undercuts or a combination thereof, but does not produce holes or perforations in said metallic element.

11. The process of claim 1, wherein said process produces a metallic element having holes or perforations, but does not produce a metallic element having protrusions, undercuts or cavities.