Photosensitive composition containing water as solvent or dispersant

• US 5,501,942 A
• Filed: 09/12/1994
• Issued: 03/26/1996
• Est. Priority Date: 12/18/1990
• Status: Expired due to Fees

• Current Assignee: Huntsman Advanced Materials Americas, Inc.
• Original Assignee: Ciba-Geigy Corporation (Novartis Ag)
• Inventors: Salvin, Roger P., Schulthess, Adrian
• Primary Examiner(s): Berman, Susan W.
• Application Number:
  US08/304,643
• Time in Patent Office: 561 Days
• Field of Search: 430/280, 430/281, 430/910, 522/85, 522/84
• US Class Current: 430/280.1
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/032 with binders
• CPC Class Codes: G03F 7/033 the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• CPC Class Codes: Y10S 430/111 Polymer of unsaturated acid or ester
• CPC Class Codes: Y10S 430/148 Light sensitive titanium compound containing

Abstract

There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates.

Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of the polymers and copolymers.

The novel compositions are photoimageable and are particularly suitable for use as solder resists.

Claims

1. A photosensitive solder resist composition which contains at least 30% by weight of water as solvent and/or dispersing medium for the components thereof and which comprises at least the following components in the indicated amounts:

10-50% by weight of water-soluble solid, crosslinkable film-forming polymers as binder selected from the group consisting of acrylic acid and methacrylic acid polymers and copolymers, and carboxyl group-containing acrylate and methacrylate polymers and copolymers, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of said polymers and copolymers, the amines being chosen such that, at least at the temperatures suitable for the thermal cure of the polymers in the composition, they will substantially volatilise from a film which forms or has formed from said composition,

4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers,

0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and,

with the proviso that when the binder contains non-selfcrosslinking polymers, then the composition further comprises

2.5-40% by weight of a thermal hardener for the polymeric binder which hardener is a water-soluble and/or water-dispersible crosslinking agent for the polymeric binder, selected from the group consisting of epoxy resins, melamine resins, blocked polyisocyanates and mixtures thereof.

2. A composition according to claim 1, wherein the carboxyl groups are reacted with ammonia.

3. A composition according to claim 1, wherein the carboxyl groups are reacted with amines which are chosen such that they substantially volatilise again at least at the temperature which is applied to form a film of the photosensitive composition from the photopolymer solution.

4. A composition according to claim 1, wherein the carboxyl groups are reacted with amines which are chosen such that they substantially volatilise again at a temperature which is above the temperature which is applied to form a film of the photosensitive composition from the polymer solution.

5. A composition according to claim 1, which contains non-selfcrosslinking polymers and an epoxy resin as sole thermal hardener.

6. A composition according to claim 1, which contains non-selfcrosslinking polymers and a blocked polyisocyanate as sole thermal hardener.

7. A composition according to claim 1, which additionally contains water-compatible fillers.

8. A composition accordingly to claim 7, which comprises 10 to 35% by weight of water-compatible fillers.

9. A photosensitive solder resist composition which contains at least 30% by weight of water as solvent and/or dispersing medium for the components thereof and which comprises at least the following components in the indicated amounts:

10-50% by weight of water-soluble solid, crosslinkable film-forming polymers as binder selected from the group consisting of acrylic acid and methacrylic acid polymers and copolymers, and carboxyl group-containing acrylate and methacrylate polymers and copolymers, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of said polymers and copolymers, the amines being chosen such that, at least at the temperatures suitable for the thermal cure of the polymers in the composition, they will substantially volatilise from a film which forms or has formed from said composition,

4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers,

0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and,

2.5-40% by weight of a thermal hardener for the polymeric binder which hardener is a water-soluble and/or water-dispersible crosslinking agent for the polymeric binder, selected from the group consisting of epoxy resins, melamine resins, blocked polyisocyanates and mixtures thereof.

10. A composition according to claim 9, wherein the carboxyl groups are reacted with ammonia.

11. A composition according to claim 9, wherein the carboxyl groups are reacted with amines which are chosen such that they substantially volatilise again at least at the temperature which is applied to form a film of the photosensitive composition from the photopolymer solution.

12. A composition according to claim 9, wherein the carboxyl groups are reacted with amines which are chosen such that they substantially volatilise again at a temperature which is above the temperature which is applied to form a film of the photosensitive composition from the polymer solution.

13. A composition according to claim 9, which additionally contains water-compatible fillers.

14. A composition accordingly to claim 13, which comprises 10 to 35% by weight of water-compatible fillers.