Wafer bonding of light emitting diode layers

• US 5,502,316 A
• Filed: 10/12/1995
• Issued: 03/26/1996
• Est. Priority Date: 03/19/1993
• Status: Expired due to Term

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Steranka, Frank M., Kish, Fred A., DeFevere, Dennis C., Uebbing, John, Robbins, Virginia M.
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US08/542,210
• Time in Patent Office: 166 Days
• Field of Search: 257/84, 257/85, 257/90, 257/94, 257/96, 257/97, 257/98, 372/50, 372/46
• US Class Current: 257/94
• CPC Class Codes: H01L 25/0756 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/0062 for devices with an active region comprising only III-V compounds
• CPC Class Codes: H01L 33/0087 with a substrate not being a II-VI compound
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/145 with a current-blocking structure
• CPC Class Codes: H01L 33/30 containing only elements of Group III and Group V of the Periodic Table

Abstract

A method of forming a light emitting diode (LED) includes providing a temporary growth substrate that is selected for compatibility with fabricating LED layers having desired mechanical characteristics. For example, lattice matching is an important consideration. LED layers are then grown on the temporary growth substrate. High crystal quality is thereby achieved, whereafter the temporary growth substrate can be removed. A second substrate is bonded to the LED layers utilizing a wafer bonding technique. The second substrate is selected for optical properties, rather than mechanical properties. Preferably, the second substrate is optically transparent and electrically conductive and the wafer bonding technique is carried out to achieve a low resistance interface between the second substrate and the LED layers. Wafer bonding can also be carried out to provide passivation or light-reflection or to define current flow.

Claims

1. A light emitting semiconductor device comprising:

an arrangement of semiconductor layers for generating light in response to a conduction of current;

an optically transparent wafer-bond layer coupled to said semiconductor layers, an interface of said wafer-bond layer with the semiconductor layers exhibiting properties characteristic of layers that have undergone wafer bonding, including a conductive ohmic bond to said semiconductor layers and being mechanically robust; and

electrode means for applying a current to said arrangement of semiconductor layers.

2. The device of claim 1 wherein said semiconductor layers are epitaxial layers and said wafer-bond layer is a semiconductor substrate.

3. The device of claim 1 further comprising a transparent wafer-bond substrate on a side of said semiconductor layers opposite to said wafer-bond layer.

4. The device of claim 1 wherein said semiconductor layers form an LED structure.

5. The device of claim 1 wherein said wafer-bond layer is a transparent substrate having a thickness greater than 8 mil, the transparent substrate being wafer bonded to said semiconductor wafers.

6. The device of claim 1 wherein said semiconductor layers include an active layer having an emission energy, said wafer-bond layer being an electrically conductive substrate having an energy gap greater than said energy emission.

7. The device of claim 1 further comprising a second optically transparent wafer-bond layer coupled to said semiconductor layers.

8. A light emitting semiconductor device comprising:

an arrangement of semiconductor layers for generating light in response to a conduction of current;

an optically transparent, conductive ohmic wafer-bond layer coupled to the semiconductor layers, an interface of said wafer-bond layer with the semiconductor layers exhibiting properties characteristic of layers that have undergone wafer bonding, the wafer-bond layer directly contacting the arrangement of semiconductor layers without any intervening metallic layer contact; and

contacts for applying a current to the arrangement of semiconductor layers.

9. The device of claim 8 wherein the semiconductor layers form a light emitting diode.

10. The device of claim 8 wherein the wafer-bond layer is a transparent substrate having a thickness greater than 8 mil, the transparent substrate being wafer bonded to the semiconductor wafers.

11. The device of claim 8 further comprising a second optically transparent conductive ohmic wafer-bond layer coupled to the semiconductor layers.

12. A light emitting semiconductor device comprising:

an arrangement of semiconductor layers for generating light in response to a conduction of current;

an optically transparent wafer-bond layer coupled to said semiconductor layers, an interface of said wafer-bond layer with the semiconductor layers exhibiting properties characteristic of layers that have undergone wafer bonding, including being mechanically robust; and

electrode means for applying a current to said arrangement of semiconductor layers.

13. The device of claim 12 wherein the wafer bond is directly adjacent to at least one semiconductor layer.

14. The device of claim 12 wherein the semiconductor layers form a light emitting diode.

15. The device of claim 12 wherein the wafer-bond layer is a transparent substrate having a thickness greater than 8 mil, the transparent substrate being wafer bonded to the semiconductor wafers.

16. The device of claim 12 further comprising a second optically transparent wafer-bond layer coupled to the semiconductor layers.