Circuit elements that are ultrasonically welded together

• US 5,502,631 A
• Filed: 10/07/1994
• Issued: 03/26/1996
• Est. Priority Date: 08/22/1990
• Status: Expired due to Fees

• Current Assignee: AUE Institute, Ltd.
• Original Assignee: AUE Institute, Ltd.
• Inventors: Adachi, Yoshio
• Primary Examiner(s): SPARKS, DONALD ALAN
• Application Number:
  US08/320,110
• Time in Patent Office: 536 Days
• Field of Search: 29/832, 29/833, 29/834, 29/837, 29/840, 174/250, 174/253, 174/254, 174/255, 174/256, 174/258, 174/260, 228/179.1, 228/180.1, 228/180.21, 228/180.22, 257/723, 257/724, 257/725, 257/778, 257/777, 257/737, 361/760, 361/767, 361/768, 361/771, 361/797, 361/779, 361/782, 361/783, 361/813, 437/209, 437/212, 437/215, 437/216, 437/217, 437/219, 156/73.1, 156/73.5, 156/73.6
• US Class Current: 361/760
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/81141 Guiding structures both on and outside the body
• CPC Class Codes: H05K 2201/1053 Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 2201/10537 Attached components
• CPC Class Codes: H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/0285 Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/328 by welding
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A new and improved electronic circuit and a method of producing the same is provided in which at least one electronic element is ultrasonically welded to a printed circuit board to create the electronic circuit. Proper alignment between terminals of a conductive circuit pattern on the circuit board and terminal units on the connecting surface of the electronic element is ensured by a variety of techniques: (i) small protuberances on the terminal units, (ii) raised sections on the bottom surface of the terminal units placed to engage indented portions of the board, and (iii) corresponding posts (on the electronic elements) and holes (formed on the circuit board). The ultrasonic welding of the element to the printed circuit board is typically conducted at a frequency range between 25-30 megahertz which produces a vibration which grinds the terminal units of the electronic element to the terminals of the circuit pattern while also welding the element and circuit board together. Electronic circuits formed in accordance with the inventive concept disclosed herein can be comprised of stacked or interlocking combinations of weldable electronic elements. Such structures can improve rigidity and vary spacial relationships of electronic circuits.

Claims

1. An ultrasonically welded electronic circuit comprising:

a circuit board formed of ultrasonically weldable material;

a conductive circuit pattern formed on the circuit board; and

at least one electronic element comprising

an ultrasonically weldable exterior region,

at least one terminal unit on a contact surface of the element for electrically coupling the element to a conductive circuit pattern of a circuit board, and

alignment means for aligning the electronic element to the circuit board so as to ensure correct positioning of the electronic element and reliable electrical coupling,

wherein the ultrasonically weldable exterior region is ultrasonically welded to the circuit board.

2. The ultrasonically welded electronic circuit according to claim 1, wherein the alignment means comprises at least one small protuberance, the small protuberance being provided on the at least one terminal unit for ensuring an electrically reliable connection between the electronic element and the conductive circuit pattern.

3. An ultrasonically welded electronic circuit according to claim 1, wherein the alignment means of the electronic element comprises a raised section of material surrounding the at least one terminal unit received by a corresponding indented surface on the circuit board.

4. An ultrasonically welded electronic circuit according to claim 1, wherein the alignment means comprises a plurality of posts on the electronic element received by a corresponding plurality of hollowed regions on the circuit board.

5. An ultrasonically welded electronic circuit according to claim 1 wherein the circuit board is formed of a thermoplastic resin.

6. An ultrasonically welded electronic circuit comprising:

a circuit board formed of ultrasonically weldable material;

a conductive circuit pattern formed on the circuit board; and

at least one electronic element comprising an ultrasonically weldable exterior region, at least one terminal unit on a contact surface of the element for electrically coupling the element to another electronic element, and alignment means for aligning the electronic element to said another electronic element so as to ensure correct positioning of the electronic element and reliable electrical coupling, wherein the ultrasonically weldable exterior region is ultrasonically welded to the circuit board.

7. The ultrasonically welded electronic circuit according to claim 6, wherein the alignment means comprises at least one small protuberance, the small protuberance being provided on the at least one terminal unit for ensuring an electrically reliable connection between the electronic element and the conductive circuit pattern.

8. An ultrasonically welded electronic circuit according to claim 6, wherein the alignment means of the electronic element comprises a raised section of material surrounding the at least one terminal unit received by a corresponding indented surface on the circuit board.

9. An ultrasonically welded electronic circuit according to claim 6, wherein the alignment means comprises a plurality of posts on the electronic element received by a corresponding plurality of hollowed regions on the circuit board.

10. An ultrasonically welded electronic circuit according to claim 6 wherein the circuit board is formed of a thermoplastic resin.