Adhesively sealed metal electronic package incorporating a multi-chip module

• US 5,504,372 A
• Filed: 12/12/1994
• Issued: 04/02/1996
• Est. Priority Date: 08/21/1992
• Status: Expired due to Fees

• Current Assignee: Advanced Technology Incubator Incorporated
• Original Assignee: OLIN Corporation
• Inventors: Mahulikar, Deepak, Braden, Jeffrey S., Crane, Jacob
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US08/353,741
• Time in Patent Office: 477 Days
• Field of Search: 257/668, 257/724, 257/723, 257/725, 257/708, 257/720, 257/706, 257/707
• US Class Current: 257/723
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/4911 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/49524 : the additional leads being a tape carrier or flat leads
• CPC Class Codes: H01L 23/49531 : the additional leads being a wiring board
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0104 : Zirconium [Zr]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01084 : Polonium [Po]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires

Abstract

There is provided a leadframe assembly for supporting a hybrid circuit. The hybrid circuit is supported by either the base of an electronic package or by a die attach paddle and electrically interconnected to a leadframe by wire bonds. A plurality of semiconductor devices are mounted on the assembly and supported by either metallization pads formed on the hybrid circuit, a dielectric layer of the hybrid circuit, a die attach paddle, a metallic package component or combinations thereof.

Claims

1. An electronic package encapsulating a plurality of integrated circuit devices, comprising:

a metallic base component formed from a copper or a copper base alloy coated with a second metal selected from the group consisting of nickel and aluminum, said metallic base component at least partially coated with a refractory oxide formed from said second metal;

a hybrid circuit assembly having a dielectric substrate supporting circuit traces and containing a first means electrically interconnecting said integrated circuit devices to external circuitry and a second means supporting said plurality of integrated circuit devices; and

a third means bonding said hybrid circuit to said metallic base component.

3. The electronic package of claim 1 wherein said third sealing means is a thermosetting polymer filled with a material to increase thermal conductivity.

4. The electronic package of claim 3 wherein said second means is selected from the group consisting of bonding of said plurality of integrated circuit devices to metallized pads formed on said dielectric substrate, bonding said plurality of integrated circuit devices to said dielectric substrate, bonding said plurality of integrated circuit devices to said inorganic dielectric layer, and bonding said plurality of integrated circuit devices to said metallic base component and combinations thereof.

5. The electronic package of claim 4 wherein said first means is selected from the group consisting of metallized interposer pads, metallic foil extending from said dielectric substrate to said inner leads and metallized bonding pads for direct attachment to said inner leads.

6. The electronic package of claim 5 wherein a polymer molding resin surrounds at least a portion of said leadframe and of said metallic base component.

2. An electronic package encapsulating a plurality of integrated circuit devices, comprising:

a metallic base component formed from a copper base alloy containing from about 2% to about 12% by weight aluminum and at least partially coated with an alumina refractory oxide layer formed in situ;

a hybrid circuit assembly having a dielectric substrate supporting circuit traces and containing a first means electrically interconnecting said integrated circuit devices to external circuitry and a second means supporting said plurality of integrated circuit devices; and

a third means bonding said hybrid circuit to said metallic base component.

7. The electronic package of claim 2 wherein said third sealing means is a thermosetting polymer filled with a material to increase thermal conductivity.

8. The electronic package of claim 7 wherein said second means is selected from the group consisting of bonding of said plurality of integrated circuit devices to metallized pads formed on said dielectric substrate, bonding said plurality of integrated circuit devices to said dielectric substrate, bonding said plurality of integrated circuit devices to said inorganic dielectric layer, and bonding said plurality of integrated circuit devices to said metallic base component and combinations thereof.

9. The electronic package of claim 8 wherein said first means is selected from the consisting of metallized interposer pads, metallic foil extending from said dielectric substrate to said inner leads and metallized bonding pads for direct attachment to said inner leads.

10. The electronic package of claim 9 wherein a polymer molding resin surrounds at least a portion of said leadframe and of said metallic base component.