Adhesively sealed metal electronic package incorporating a multi-chip module
First Claim
Patent Images
1. An electronic package encapsulating a plurality of integrated circuit devices, comprising:
- a metallic base component formed from a copper or a copper base alloy coated with a second metal selected from the group consisting of nickel and aluminum, said metallic base component at least partially coated with a refractory oxide formed from said second metal;
a hybrid circuit assembly having a dielectric substrate supporting circuit traces and containing a first means electrically interconnecting said integrated circuit devices to external circuitry and a second means supporting said plurality of integrated circuit devices; and
a third means bonding said hybrid circuit to said metallic base component.
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Abstract
There is provided a leadframe assembly for supporting a hybrid circuit. The hybrid circuit is supported by either the base of an electronic package or by a die attach paddle and electrically interconnected to a leadframe by wire bonds. A plurality of semiconductor devices are mounted on the assembly and supported by either metallization pads formed on the hybrid circuit, a dielectric layer of the hybrid circuit, a die attach paddle, a metallic package component or combinations thereof.
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Citations
10 Claims
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1. An electronic package encapsulating a plurality of integrated circuit devices, comprising:
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a metallic base component formed from a copper or a copper base alloy coated with a second metal selected from the group consisting of nickel and aluminum, said metallic base component at least partially coated with a refractory oxide formed from said second metal; a hybrid circuit assembly having a dielectric substrate supporting circuit traces and containing a first means electrically interconnecting said integrated circuit devices to external circuitry and a second means supporting said plurality of integrated circuit devices; and a third means bonding said hybrid circuit to said metallic base component. - View Dependent Claims (3, 4, 5, 6)
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2. An electronic package encapsulating a plurality of integrated circuit devices, comprising:
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a metallic base component formed from a copper base alloy containing from about 2% to about 12% by weight aluminum and at least partially coated with an alumina refractory oxide layer formed in situ; a hybrid circuit assembly having a dielectric substrate supporting circuit traces and containing a first means electrically interconnecting said integrated circuit devices to external circuitry and a second means supporting said plurality of integrated circuit devices; and a third means bonding said hybrid circuit to said metallic base component. - View Dependent Claims (7, 8, 9, 10)
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Specification