Direct cooled switching module for electric vehicle propulsion system

• US 5,504,378 A
• Filed: 06/10/1994
• Issued: 04/02/1996
• Est. Priority Date: 06/10/1994
• Status: Expired due to Term

• Current Assignee: Northrop Grumman Corporation
• Original Assignee: Westinghouse Electric Corporation (Paramount Global (f/k/a ViacomCBS Inc.))
• Inventors: Hall, William B., Young, Richard M., Lindberg, Frank A., Nguyen, Ngon B., Altoz, Frank E.
• Primary Examiner(s): Shoop, Jr., William M.
• Assistant Examiner(s): Elms, Richard T.
• Application Number:
  US08/258,027
• Time in Patent Office: 662 Days
• Field of Search: 307/9.1, 307/10.1, 180/65.1, 180/65.8, 310/DIG. 6, 363/141, 363/144, 174/252, 257/707, 257/712-714, 361/704, 361/707, 361/717-719, 361/709-713, 361/720-722, 361/728, 361/729, 361/689, 361/698, 361/699, 361/735, 361/736, 361/750, 361/752, 361/753, 318/254, 165/104.33
• US Class Current: 307/10.1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1627 stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

An apparatus for cooling a switching circuit for an electric vehicle, wherein the switching circuit has at least two switching elements connected in series, includes first and second heat sinks, each having two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage, and a substrate for mounting at least one switching element to each of the first and second heat sinks. An ac terminal connects the switching element attached to the first heat sink in series with the switching element attached to the second heat sink, and inlet and outlet manifolds, coupled to the inlet and outlet ports of the first and second heat sinks, circulate cooling fluid through the passages of the first and second heat sinks to cool the switching elements.

Claims

1. Apparatus for cooling a switching circuit for an electric vehicle, wherein the switching circuit has at least two switching elements connected in series, the apparatus comprising:

a first heat sink having two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage;

a second heat sink having two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage;

means for mounting at least one switching element to the first heat sink and means for mounting at least one switching element to the second heat sink;

means for connecting the switching element attached to the first heat sink in series with the switching element attached to the second heat sink; and

means, coupled to the inlet and outlet ports of the first and second heat sinks, for circulating cooling fluid through the passages of the first and second heat sinks to cool the switching elements.

2. The apparatus of claim 1, wherein the mounting means comprises an electrically insulating and thermally conductive substrate attached to each of the heat sinks.

3. The apparatus of claim 1, wherein one of the planar members of each of the first and second heat sinks comprises a plurality of grooves to form a plurality of parallel passages between the planar members of each of the heat sinks.

4. The apparatus of claim 3, wherein the mounting means comprises a plurality of substrates attached to each of the first and second heat sinks, wherein the plurality of substrates are positioned on the heat sinks above the plurality of parallel passages.

5. The apparatus of claim 3, wherein each of the plurality of parallel passages includes an inlet and an outlet, the inlets of the parallel passages communicating with the inlet port of the heat sink and the outlets of the parallel passages communicating with the outlet port of the heat sink so that an inlet temperature of the cooling fluid is substantially the same at each of the inlets of the parallel passages.

6. The apparatus of claim 1, further comprising thermally-conductive fins secured to at least one of the planar members and extending into the passage to facilitate heat transfer to the cooling fluid flowing through the passage.

7. The apparatus of claim 3, further comprising thermally-conductive fins secured to at least one of the planar members and extending into the passages to facilitate heat transfer to the cooling fluid flowing through the passages.

8. A fluid-cooled switching module for an electric vehicle, comprising:

upper and lower mounting assemblies, each mounting assembly including;

a heat sink having a top surface, two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage;

a first conductive member laminated to the top surface of the heat sink with a dielectric material;

a second conductive member laminated to the first conductive member with a dielectric material;

a plurality of thermally-conductive substrates attached to the top surface of the heat sink; and

a plurality of transistors attached to the heat sink via the plurality of substrates, each transistor having a collector connected to the first conductive member and an emitter connected to the second conductive member;

a drive current terminal connecting the second conductive member of the lower mounting assembly with the first conductive member of the upper mounting assembly;

a bus bar connecting the first conductive member of the lower mounting assembly to a positive voltage source;

a negative terminal connecting the second conductive member of the upper mounting assembly to a common ground member; and

means, communicating with the inlet and outlet ports of the heat sinks of the upper and lower mounting assemblies, for circulating cooling fluid through the heat sinks.

9. The module of claim 8, wherein the transistors are insulated gate bipolar transistors.

10. The module of claim 8, wherein a portion of each of the first and second conductive members protrudes from a side of the heat sink in each of the upper and lower mounting assemblies.

11. The module of claim 10, wherein the drive current terminal is disposed between the upper and lower mounting assemblies to contact the protruding portion of the second conductive member of the lower mounting assembly and contact the protruding portion of the first conductive member of the upper mounting assembly, the drive current terminal supplying a drive current to motor windings of the electric vehicle.

12. The module of claim 11, wherein the bus bar is secured to the protruding portion of the first conductive member of the lower mounting assembly.

13. The module of claim 12, wherein the negative terminal is secured to the protruding portion of the second conductive member of the upper mounting assembly.

14. The module of claim 13, wherein the drive current terminal, the bus bar, and the negative terminal are all disposed on a same side of the upper and lower mounting assemblies.

15. The module of claim 8, wherein the substrates are composed of beryllium oxide.

16. The module of claim 8, wherein each of the upper and lower mounting assemblies further comprises a first metallic layer disposed between the substrates and the top surface of the heat sink.

17. The module of claim 16, wherein each of the upper and lower mounting assemblies further comprises a second metallic layer disposed between the transistors and the substrates.

18. The module of claim 17, wherein each of the upper and lower mounting assemblies further comprises a third metallic layer disposed between the top surface of the heat sink and the first metallic layer, and between the top surface of the heat sink and the first conductive member.

19. A fluid-cooled switching module assembly for an electric vehicle, comprising:

a pair of switching modules, each switching module comprising;

upper and lower heat sinks, each heat sink having a passage for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage;

at least one switching element attached to the upper heat sink and at least one switching element attached to the lower heat sink;

a drive terminal connecting the switching element attached to the upper heat sink in series with the switching element attached to the lower heat sink; and

means for joining the upper heat sink with the lower heat sink in a spaced, parallel relationship;

means, communicating with the inlet and outlet ports of the heat sinks of the pair of switching modules, for circulating cooling fluid through the heat sinks; and

means for joining the pair of switching modules in an opposed, parallel relationship so that the lower heat sink of one of the modules faces the lower heat sink of the other module.

20. The assembly of claim 19, wherein the switching elements are insulated gate bipolar transistors, each having a collector and an emitter.

21. The assembly of claim 19, further comprising:

a bus bar for connecting the switching elements attached to the lower heat sinks of the pair of switching modules to a positive terminal of a voltage source; and

a negative terminal for connecting the switching elements attached to the upper heat sinks of the pair of switching modules to a common ground member.

22. The assembly of claim 20, wherein each of the pair of switching modules further comprises a collector plate laminated to each of the upper and lower heats sink with a thermally-conductive, dielectric material, the collector plate electrically connected to the collectors of the transistors, and an emitter plate laminated to the collector plate with a thermally-conductive, dielectric material, the emitter plate electrically connected to the emitters of the transistors, wherein a current in the collector plate is balanced by an opposite flowing current in the emitter plate.

23. The assembly of claim 21, wherein the drive terminal, the bus bar, and the negative terminal are all disposed on a same side of the pair of switching modules when the modules are joined.