×

Structural panel having integral heat pipe network

  • US 5,506,032 A
  • Filed: 04/08/1994
  • Issued: 04/09/1996
  • Est. Priority Date: 04/08/1994
  • Status: Expired due to Term
First Claim
Patent Images

1. A panel comprising:

  • at least three elongated first heat conducting elements each having a high heat conductance along its length, said first heat conducting elements being closely spaced in side-by-side thermally-coupled relationship;

    at least three elongated second heat conducting elements each having a high heat conductance along its length, said second heat conducting elements being arrayed in spaced-apart, side-by-side relationship proximate to and angled to intersect said first heat conducting elements, said first heat conducting elements being substantially perpendicular to said second heat conducting elements at said intersection, each of said second heat conducting elements being proximate to and thermally coupled to said first heat conducting elements proximate said intersections;

    a first facesheet of a thermally conductive material having a first surface thermally coupled to each of said second heat conducting elements along the lengths thereof, said first facesheet having a second surface opposite its first surface;

    a thermal control material on said second surface of said first facesheet having a thermal emissivity that is substantially greater than its solar absorptivity; and

    a second facesheet of a thermally conductive material having a first surface thermally coupled to each of said first heat conducting elements along the lengths thereof and having a second surface for receiving thereon at predetermined locations overlying said first heat conducting elements a plurality of devices to be thermally controlled.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×