Optical transceiver module

• US 5,506,445 A
• Filed: 02/03/1995
• Issued: 04/09/1996
• Est. Priority Date: 06/24/1994
• Status: Expired due to Fees

• Current Assignee: Avago Technologies Fiber IP Singapore PTE Limited (Broadcom, Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Rosenberg, Paul
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/382,831
• Time in Patent Office: 431 Days
• Field of Search: 257/666, 257/679, 257/680, 257/681, 257/682, 257/683, 257/684, 257/432, 257/433, 257/434, 257/81, 257/82, 257/100
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H04B 10/11 Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An integrated optical transceiver for optical serial communication is disclosed. The transceiver is formed as a single molded package incorporating an IC that forms part of the operating circuitry of the transceiver and the leadframe upon which the IC has been mounted. The necessary discrete components comprising at least an LED and photodiode coupled to both the IC and the leadframe. The leads of the leadframe can be formed in several different ways, which permits mounting the integrated transceiver in many different orientations. The integrated transceiver is more durable that transceivers realized using discrete components and provides users with unusual design flexibility, given the plurality of positions in which the transceiver can be mounted.

Claims

1. An optical transceiver comprising:

an optical transceiver circuit comprising at least a transmitting light emitting diode and a receiving phototransistor;

a leadframe with a plurality of electrical leads upon which the optical transceiver circuit is mounted and to which the optical transceiver circuit is coupled and a plurality of electrically inactive support leads not electrically coupled to the optical transceiver circuit; and

molded package surrounding the leadframe and the optical transceiver circuit, the molded package being substantially transparent to the light generated by the light emitting diode and received by the phototransistor, the electrical leads and the support leads of the leadframe extending from the package, and the transceiver having a plurality of mounting positions dependent upon the final configuration of the electrical leads extending from the package, the support leads increasing the stability of the mounted transceiver in each of the plurality of mounting positions.

2. The optical transceiver of claim 1 wherein the optical transceiver circuit further comprises:

an infrared light emitting diode;

a power transistor coupled to the infrared light emitting diode for driving the infrared light emitting diode;

a photodiode which transforms infrared radiation into an electrical current; and

a receiver circuit coupled to the photodiode for amplifying and quantizing the electrical current.