Method and apparatus for a stress relieved electronic module

• US 5,506,753 A
• Filed: 09/26/1994
• Issued: 04/09/1996
• Est. Priority Date: 09/26/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Bertin, Claude L., Farrar, Paul A., Miller, Christopher P., Kelley, Gordon A. Jr.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/311,815
• Time in Patent Office: 561 Days
• Field of Search: 165/80.2, 165/185, 174/16.3, 257/706-707, 257/713, 257/714, 257/718-719, 257/726, 257/777, 361/689-690, 361/698-699, 361/704-710, 361/735, 361/744, 361/790
• US Class Current: 361/705
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06555 Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06586 Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

A fabrication method and resultant electronic module that facilitates relief of thermally induced stress within the module. The fabrication method includes providing a plurality of integrated circuit chips having grooves in substantially planar main surfaces thereof. The chips are stacked and bonded to each other using an expandable material and a flowable adhesive to form an electronic module. The bonding is such that movement of individual IC chips within the module, in a direction perpendicular to their planar surfaces, is restricted. Upon thermal expansion of the module, the expandable material and the individual chips expand at different rates. However, the expandable material flows into the grooves, relieving thermally induced stress.

Claims

1. An electronic module comprising:

a semiconductor structure having a substantially planar surface;

a first integrated circuit ("IC") chip having a substantially planar main surface including a cavity therein, said substantially planar main surface of said first IC chip being disposed in parallel opposing relation to said substantially planar surface of said semiconductor structure, said first IC chip having a first rate of thermal expansion;

an expandable material disposed between and mechanically coupled to said substantially planar surface of said semiconductor structure and to said substantially planar main surface of said first IC chip, said expandable material having a second rate of thermal expansion; and

wherein the first rate of thermal expansion of said first IC chip is different than the second rate of thermal expansion of said expandable material, and wherein said cavity provides a region into which said expandable material expands to relieve stress caused by said difference in thermal expansion between said expandable material and said first IC chip.

2. The electronic module of claim 1, wherein said semiconductor structure comprises a second IC chip, and wherein said substantially planar surface comprises a substantially planar main surface of the second IC chip.

3. The electronic module of claim 2, wherein the substantially planar main surface of the first IC chip comprises an inactive surface and the substantially planar main surface of the second IC chip comprises an active surface.

4. The electronic module of claim 1, further comprising a mechanical constraint means mechanically coupled to said IC chip and to said semiconductor structure for preventing expansion of the electronic module in a direction perpendicular to the substantially planar main surface of the first IC chip.

5. The electronic module of claim 1, wherein the cavity extends into the first integrated circuit chip a depth having a first length, and wherein the expandable material has a thickness of a second length, said second length being less than said first length.

6. The electronic module of claim 1, wherein said cavity within said first IC chip comprises at least one groove within said first IC chip.

7. The electronic module of claim 1, wherein said cavity within said first IC chip is sized such that a coolant may pass through the cavity within said first IC chip.

8. The electronic module of claim 1, wherein said semiconductor structure comprises a mounting substrate.

9. The electronic module of claim 1, further comprising a flowable adhesive disposed between and mechanically bonded to said expandable material and to said substantially planar surface of said semiconductor structure for facilitating said expandable material being mechanically coupled to said substantially planar surface of said semiconductor structure.

10. The electronic module of claim 1, further comprising a flowable adhesive disposed between and mechanically bonded to said expandable material and to said substantially planar main surface of said first integrated circuit chip for facilitating said expandable material being mechanically coupled to said substantially planar main surface of said first integrated circuit chip.

11. An electronic module comprising:

a plurality of integrated circuit ("IC") chips, each IC chip of said plurality of IC chips having a substantially planar active main surface and a substantially planar inactive main surface, a substantially planar inactive main surface of a first IC chip of said plurality of IC chips having a plurality of grooves therein, said plurality of IC chips being stacked to form an electronic module wherein said substantially planar active main surfaces are oriented in a common direction;

an expandable material disposed between and mechanically coupling a substantially planar active main surface of a second IC chip of said plurality of IC chips to said substantially planar inactive main surface of the first IC chip of said plurality of IC chips, said second IC chip having a first rate of thermal expansion and said expandable material having a second rate of thermal expansion, said second rate of thermal expansion being different than the first rate of thermal expansion; and

wherein said plurality of grooves in said substantially planar inactive main surface of said first IC chip provides a plurality of regions into which said expandable material can expand to relieve stress caused by said difference in thermal expansion between said expandable material and said second integrated circuit chip.

12. The electronic module of claim 11, further comprising a mechanical constraint means mechanically coupled to said first IC chip and to said, second IC chip for preventing expansion of the electronic module in a direction perpendicular to the substantially planar main surface of each IC chip of said plurality of IC chips.

13. The electronic module of claim 11, wherein said plurality of grooves in said first IC chip are sized such that a coolant may pass therethrough.

14. The electronic module of claim 11, further comprising an expandable material disposed between and mechanically bonding a substantially planar inactive main surface of the second IC chip of said plurality of IC chips to a substantially planar active main surface of a third IC chip of said plurality of IC chips, said substantially planar inactive main surface of the second IC chip having a plurality of grooves therein.

15. The electronic module of claim 11, further comprising a flowable adhesive disposed between and mechanically bonding said expandable material to said substantially planar active main surface of said second IC chip for providing said mechanical coupling therebetween.

16. The electronic module of claim 11, further comprising a flowable adhesive disposed between and mechanically bonding said expandable material to said substantially planar inactive main surface of said first IC chip for providing said mechanical coupling therebetween.

17. An electronic module comprising:

a plurality of stacked integrated circuit ("IC") chips, each individual IC chip of said plurality of IC chips being a bare IC chip and having a first substantially planar main surface and a second substantially planar main surface;

an advanced thermal compound disposed between and mechanically bonded to a first substantially planar main surface of a first IC chip of said plurality of IC chips and to a second substantially planar main surface of a second IC chip of said plurality of IC chips, said advanced thermal compound being thermally conductive and electrically insulative; and

wherein said first substantially planar main surface of said first IC chip has at least one cavity disposed therein, said advanced thermal compound at least partially filling said cavity.

18. The electronic module of claim 17, further comprising additional advanced thermal compound disposed between and mechanically bonded to a first substantially planar main surface of at least some IC chips of said plurality of IC chips other than said first IC chip, and to a second substantially planar main surface of an adjacent IC chip of said plurality of IC chips.

19. The electronic module of claim 17, wherein said at least one cavity comprises a plurality of grooves.

20. A method for forming an electronic module comprising:

(a) providing a semiconductor structure having a substantially planar surface;

(b) providing a first integrated circuit ("IC") chip having a substantially planar main surface including a cavity therein, said first IC chip having a first rate of thermal expansion; and

(c) mechanically coupling said substantially planar surface of said semiconductor structure to said substantially planar main surface of said first IC chip with an expandable material, said expandable material having a second rate of thermal expansion different than said first rate of thermal expansion, wherein said cavity provides a region into which said expandable material expands to relieve stress caused by differences in thermal expansion between said expandable material and said first IC chip.

21. The method of claim 20, wherein said providing step (a) comprises providing as said semiconductor structure a second IC chip having a substantially planar main surface, said substantially planar main surface comprising said substantially planar surface of said semiconductor structure.

22. The method of claim 21, wherein said providing step (a) comprises providing the second IC chip with an active surface as said substantially planar main surface, and wherein said providing step (b) comprises providing the first IC chip with an inactive surface as said substantially planar main surface.

23. The method of claim 20, further comprising providing a constraint mechanically coupled to said semiconductor structure and to said first IC chip for constraining expansion of the electronic module in a direction perpendicular to the substantially planar main surface of the first IC chip.

24. The method of claim 20, wherein said providing step (b) comprises providing said first IC chip wherein said cavity comprises at least one groove.

25. The method of claim 20, wherein said providing step (b) comprises providing said first IC chip with said cavity sized to facilitate a flow of coolant through said cavity.

26. The method of claim 20, wherein said providing step (a) comprises providing a mounting substrate as said semiconductor structure.

27. The method of claim 20, wherein said mechanical coupling step (c) mechanically coupling said expandable material to said substantially planar surface of said semiconductor structure using a flowable adhesive.

28. The method of claim 20, wherein said mechanical coupling step (c) comprises mechanically coupling said expandable material to said substantially planar main surface of said first IC chip using a flowable adhesive.

29. A method for forming an electronic module comprising the steps of:

(a) providing a plurality of stacked integrated circuit ("IC") chips, each individual IC chip of said plurality of stacked IC chips being a bare IC chip and having a first substantially planar main surface and a second substantially planar main surface; and

(b) mechanically coupling a first substantially planar main surface of a first IC chip of said plurality of IC chips to a second substantially planar main surface of a second IC chip of said plurality of IC chips using an advanced thermal compound, said advanced thermal compound being thermally conductive and electrically insulative,

wherein said substantially planar main surface of said first IC chip has at least one cavity disposed therein and said mechanically coupling comprises at least partially filling said at least one cavity with said advanced thermal compound.

30. The method of claim 29, wherein said coupling step (b) comprises bonding said advanced thermal compound to said first substantially planar main surface of said first IC chip using a flowable adhesive.

31. The method of claim 29, wherein said at least one cavity comprises a plurality of grooves, and wherein said coupling step (b) comprises filling said plurality of grooves with advanced thermal compound.