Semiconductor module

• US 5,508,560 A
• Filed: 11/08/1994
• Issued: 04/16/1996
• Est. Priority Date: 11/08/1993
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Eupec Europeische Gesellschaft F Leistungshalbleiter mbH & Company KG
• Inventors: Koehler, Werner, Spanke, Reinhold
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/336,319
• Time in Patent Office: 525 Days
• Field of Search: 257/730, 257/709, 257/707, 257/706, 257/717, 257/699
• US Class Current: 257/730
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/341 Surface mounted components

Abstract

A semiconductor module includes a metal base plate having a plane upper sace and a convex lower surface. An electrically insulating and thermally conductive substrate is material-lockingly connected to the upper surface of the metal base plate. Semiconductor chips are material-lockingly connected to an upper surface of the substrate.

Claims

1. A semiconductor module, comprising:

a metal base plate having an upper surface and a lower surface;

an electrically insulating and thermally conductive substrate connected to said upper surface of said metal base plate, said substrate having an upper surface; and

semiconductor chips disposed on and connected to said upper surface of said substrate;

said upper surface of said metal base plate being plane and said lower surface of said metal base plate being convex.

2. The semiconductor module according to claim 1, wherein said lower surface of said base plate is convex in longitudinal and transverse directions.

3. The semiconductor module according to claim 1, wherein said semiconductor chips are soldered to said substrate.

4. The semiconductor module according to claim 1, wherein said substrate is soldered to said base plate.

5. The semiconductor module according to claim 2, wherein said lower surface of said base plate is dome-shaped.