System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind

• US 5,508,884 A
• Filed: 06/01/1995
• Issued: 04/16/1996
• Est. Priority Date: 12/16/1992
• Status: Expired due to Fees

• Current Assignee: Alcatel Telspace
• Original Assignee: Alcatel Telspace
• Inventors: Brunet, Patrice, Avignon, Gilles, Heron, Franck
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/457,302
• Time in Patent Office: 320 Days
• Field of Search: 237/66, 174/15.2, 62/259.2, 257/712, 257/714, 257/721, 257/722, 361/689-691, 361/698-700, 361/722, 165/32, 165/39, 165/80.5, 165/104.21, 165/104.23, 165/104.27, 165/104.28, 165/104.33, 165/104.34, 165/80.4, 165/46
• US Class Current: 361/698
• CPC Class Codes: F28D 15/06 Control arrangements therefor
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind.

The system for dissipating heat of the invention is of the type comprising a sealed metal enclosure (21) the interior volume of which contains a fluid (22), said component (11) being fixed to the outside wall of said enclosure (21) and connected to a heat dissipator (12) by said enclosure (21) and is characterized in that the phase change temperature of the fluid (22) at atmospheric pressure is less than a given maximum ambient temperature and in that said enclosure (21) also contains a volume of gas (23) different from the fluid (22) so that variation in the ambient temperature causes a variation in the pressure inside the enclosure (21) which modifies the phase change temperature of the fluid (22).

Claims

1. A system for dissipating heat energy generated by an electronic component comprising a sealed metal enclosure the interior volume of which contains a liquid having a phase change temperature at atmospheric pressure, said component being fixed to the outside wall of said enclosure and connected to a heat dissipator by said enclosure,

characterized in that the phase change temperature of said liquid at atmospheric pressure is less than a given maximum ambient temperature and in that said enclosure also contains a volume of a gas, said gas not being a vapor of said liquid and being only a gas at atmospheric pressure so that variation in the ambient temperature causes a variation in the pressure inside said enclosure which modifies the phase change temperature of said liquid, further characterized in that the ratio by which said enclosure is filled with said liquid is equal to:

##EQU5## with v₀ =v_i =v₀.β

.Δ

T where;

V₀ is the volume of liquid used;

v₀ is the residual volume of gas inside the enclosure under initial conditions;

β

is the coefficient of thermal expansion of the liquid;

Δ

T=T_i -T₀ where T_i is the maximum ambient temperature and T₀ is the temperature at which the enclosure is filled;

P₀ is the ambient pressure when the enclosure is filled;

P_i is the pressure inside the enclosure at temperature T_i ;

v_i is the volume of the gas in the enclosure at the pressure P_i.

2. A system according to claim 1 characterized in that said enclosure has two substantially parallel walls and in that said component and said dissipator are each fixed to a respective one of said walls.

3. A system according to claim 1 characterized in that said component and said dissipator are fixed to the same wall of said enclosure.

4. A system according to claim 1 characterized in that said enclosure includes at least one pressurized gas concentration region which is not filled with said liquid when the ambient temperature is less than said maximum ambient temperature, said region being disposed for receiving said gas as said liquid expands at ambient temperature ever said phase change temperature, whereby said expanded liquid is operative to establish thermal contact between said component and said dissipator.

5. A system according to claim 1 characterized in that said component is a microwave transistor mounted in an electromagnetic shield box.

6. System according to claim 1 characterized in that said gas is air.

7. A sealed metal enclosure whose interior volume contains a liquid characterized in that the phase change temperature of said liquid at atmospheric pressure is less than a given maximum ambient temperature and in that said enclosure also contains a volume of a gas at said atmospheric pressure, said gas not being a vapor of said liquid so that variation in the ambient temperature causes a variation in pressure inside said enclosure which modifies the phase change temperature of said liquid, further characterized in that the ratio by which said enclosure is filled with said liquid is equal to:

##EQU6## with v₀ =v_i +v₀.β

.Δ

T where;

V₀ is the volume of liquid used;

v₀ is the residual volume of gas inside the enclosure under initial conditions;

β

is the coefficient of thermal expansion of the liquid;

Δ

T=T_i -T₀ where T_i is the maximum ambient temperature and T₀ is the temperature at which the enclosure is filled;

P₀ is the ambient pressure when the enclosure is filled;

P_i is the pressure inside the enclosure at temperature T_i ;

v_i is the volume of the gas in the enclosure at the pressure P_i.

8. An enclosure according to claim 7 characterized in that it includes at least one pressurized gas concentration region which is not filled with said liquid when the ambient temperature is less than said maximum ambient temperature, said region being disposed for receiving said gas when pressurized as said liquid expands at ambient temperatures over said phase change temperature, whereby said expanded liquid is operative to establish thermal contact between an electronic component and a heat dissipator.

9. Enclosure according to claim 7 characterized in that said gas is air.