Method for manufacturing smart cards
First Claim
1. Method of manufacturing a smart card having a thermoplastic material card body with substantially parallel major sides;
- a support member with a graphic on at least one side; and
an electronic module comprising a contact array to one side of which is fixed a chip including an integrated circuit, comprising the steps of;
placing said support member in a mold comprising a hollow space defining volume and shape of said card and delimited by first and second main walls corresponding to the major sides of said card;
holding said support member against said first main wall of said mold;
injecting a thermoplastic material into the volume defined by said hollow space to fill that portion of said volume not occupied by said support member; and
then inserting said electronic module at an appropriate position in said thermoplastic material before said injected material has solidified completely.
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Accused Products
Abstract
A smart card is made of a thermoplastic material card body having two substantially parallel major sides. A support member with a graphic on it is on at least one side of the card. An electronic module has a contact array to one side of which is fixed a chip including an integrated circuit. The support member is placed in a mold comprising an hollow space defining the shape of the card and delimited by two main walls corresponding to the major sides of the card, and it is held against one of these main walls. A thermoplastic material is injected into the volume defined by the hollow space to fill the volume not occupied by the support member. The electronic module is placed at an appropriate position in the hollow space before the injected material has solidified completely.
85 Citations
10 Claims
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1. Method of manufacturing a smart card having a thermoplastic material card body with substantially parallel major sides;
- a support member with a graphic on at least one side; and
an electronic module comprising a contact array to one side of which is fixed a chip including an integrated circuit, comprising the steps of;placing said support member in a mold comprising a hollow space defining volume and shape of said card and delimited by first and second main walls corresponding to the major sides of said card; holding said support member against said first main wall of said mold; injecting a thermoplastic material into the volume defined by said hollow space to fill that portion of said volume not occupied by said support member; and then inserting said electronic module at an appropriate position in said thermoplastic material before said injected material has solidified completely. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
- a support member with a graphic on at least one side; and
Specification