Process for producing a pressure transducer using silicon-on-insulator technology
First Claim
1. A process for producing an integrated pressure transducer having at least one deformable diaphragm integral with a monocrystalline silicon substrate and means for measuring deformation of the diaphragm, said process comprising the following steps, in sequence, of:
- a) implanting oxygen ions in the monocrystalline silicon substrate (6,6a) and annealing the substrate at a temperature about 1150°
C. to about 1400°
C. in order to form a monocrystalline silicon film (44,44a) on the substrate and separated from the substrate, at least locally, by an insulating layer (42,42a),b) producing an opening (26,26a) in the silicon film down to the insulating layer,c) partially eliminating the insulating layer via said opening in order to form the diaphragm in the silicon film,d) resealing said opening (24,24a), said process also including producing at least one buried electrode contact layer (12,111,113,115) in the silicon substrate facing the deformable diaphragm, said production of said buried electrode contact layer taking place following the annealing of the substrate.
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Abstract
A process for producing a pressure transducer or sensor using the silicon-on-insulator method is provided. The process includes the following steps: (a) producing a monocrystalline silicon film (44) on a silicon substrate (6) at least locally separated from the latter by an insulating layer (42), (b) producing an opening (24) in the silicon film down to the insulating layer, (c) partially eliminating the insulating layer via the opening in order to form the diaphragm in the silicon film, and (d) resealing the opening (26).
83 Citations
13 Claims
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1. A process for producing an integrated pressure transducer having at least one deformable diaphragm integral with a monocrystalline silicon substrate and means for measuring deformation of the diaphragm, said process comprising the following steps, in sequence, of:
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a) implanting oxygen ions in the monocrystalline silicon substrate (6,6a) and annealing the substrate at a temperature about 1150°
C. to about 1400°
C. in order to form a monocrystalline silicon film (44,44a) on the substrate and separated from the substrate, at least locally, by an insulating layer (42,42a),b) producing an opening (26,26a) in the silicon film down to the insulating layer, c) partially eliminating the insulating layer via said opening in order to form the diaphragm in the silicon film, d) resealing said opening (24,24a), said process also including producing at least one buried electrode contact layer (12,111,113,115) in the silicon substrate facing the deformable diaphragm, said production of said buried electrode contact layer taking place following the annealing of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification